Osiris International GmbH

Josef-Schüttler-Str. 2
Singen,  78224

Germany
http://www.osiris-nano.com
  • Booth: 1445


We invite you to visit us on our booth!

Osiris International is a manufacturer of machines specializing in photolithographic process equipment used in semiconductor and microsystems (MEMS) technology.

The main application areas for surface treatment of wafers, substrates or masks are the following processing applications.

photoresist spin & spray coating, developing, baking,
wet cleaning, post CMP cleaning, etching, stripping & metal lift-off and
temporary bonding & de-bonding.

In addition to the production of our machines, which range from laboratory systems to semi-automatic and fully automatic systems, we also offer sub-systems such as PR Dispense Systems (Pumps, Syringe or CPD) and media supply cabinets with various canister designs.

We supply our technologies worldwide to major semiconductor manufacturers and internationally renowned research and development institutions.

In addition to our office in Germany, which covers all areas of administration, production and development, there is a foreign branch office Osiris International Inc. in Phoenix, Arizona especially for our US customers.

 Press Releases

  • YES Announces Strategic Partnership with Osiris for Edge Film Removal Technology

    Singen, Germany - October, 2021


    YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has signed an exclusive agreement with Osiris (Osiris International GmbH) to license its smartEBR technology for edge bead removal on panels. This proprietary process, based on wet etch chemistry, will enable YES to expand its wet processing capabilities.


    "We are very pleased to partner with YES in this effort to extend our smartEBR technology to more complex applications," said Pirmin Muffler, Managing Director of Osiris. "We selected YES as our partner because of their proven ability to rapidly bring innovation to high-volume manufacturing production environments."


    "YES is committed to developing a variety of solutions for panel-based applications in the PCB and advanced packaging markets" said Zia Karim, CTO of YES. "When combined with our extensive process expertise, the smartEBR technology will allow our customers to remove metal, photoresist and dielectric coatings efficiently from a variety of panel types, ensuring high yield and defect control."


    "Our mission is to be the preferred provider of surface modification and material enhancement solutions in the markets that we serve," said Rezwan Lateef, President of YES. "The Osiris EBR technology adds an important element to our product portfolio, as we continue to support and enable the ambitious roadmaps of our key semiconductor customers."


    Osiris International GmbH
    Osiris International GmbH is a manufacturer of machines specializing in photolithographic process equipment used in semiconductor, microOLED, Mask and microsystems (MEMS) technology. The company provides a wide range of optimized front- and back-end solutions used in the processing of a variety of substrates.


    Yield Engineering Systems, Inc.
    YES is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials, and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence.

    Further information:
    Osiris International GmbH
    Josef-Schüttler-Str. 2
    78224 Singen Htwl.
    E-Mail: info@osiris-nano.com
    www.osiris-nano.com

    Yield Engineering Systems, Inc.
    3178 Laurelview Ct.
    Fremont CA 94538
    www.yieldengineering.com

  • RSBG Advanced Manufacturing Technologies GmbH acquires majority of shares from Osiris International GmbH

    Singen, Germany - September, 2021


    RSBG Advanced Manufacturing Technologies GmbH (RSBG AMT), an investment company founded in 2019 and a wholly owned subsidiary of RSBG SE headquartered in Essen, Germany, holds 75.1% of Osiris International GmbH, headquartered in Singen, Germany, with retroactive effect from Jan. 1, 2021.


    "With Osiris International, we have been able to win a medium-sized high-tech company that fits perfectly with RSBG Advanced Manufacturing, not only because of its growth prospects, but also because of its market-leading product range and not least because of its excellent technological competence," says Dr. Andreas Jäger, Investment Director of RSBG SE.


    The founders of Osiris International GmbH are equally looking forward to working together in a top-class, inspiring environment, that RSBG SE, as a strong partner of Osiris International, will offer in the future.


    "With Osiris International GmbH, we are expanding our product portfolio to include high-tech products "Made in Germany". With Osiris International we are now able to provide our customers the full process for micro- and nanostructures. We are happy that we were able to assert ourselves in the competition with other interested parties and that the technology remains in Baden-Württemberg, Germany" says Martin Wynaendts van Resandt, Managing Director of the "Advanced Manufacturing" division of RSBG SE.


    Osiris International GmbH
    Osiris International GmbH is a manufacturer of machines that specializes in photolithographic process equipment for semiconductor and microsystem technology (MEMS).


    RSBG Advanced Manufacturing Technologies GmbH
    RSBG Advanced Manufacturing Technologies GmbH (RSBG AMT), is a holding company founded in 2019 and a 100 % subsidiary of RSBG SE based in Essen, Germany. RSBG AMT includes Heidelberg Instruments and its Swiss subsidiary SwissLitho, Multiphoton Optics, Notion Systems, GenISys as well as 40-30 and the SPECS Group.

    Further information:
    Osiris International GmbH
    Josef-Schüttler-Str. 2
    78224 Singen Htwl.
    E-Mail: info@osiris-nano.com
    www.osiris-nano.com

    RSBG Advanced Manufacturing Technologies GmbH
    Im Welterbe 10
    45141 Essen
    E-Mail: info@rsbg-amt.com
    www.rsbg-amt.com

 Products

  • Resist spray coater - UNIXX SP 760
    The osiris spray coating system UNIXX SP760 is a innovative spray coating concept that combines two different spray methods. Spray coater for all topographies and shapes in one system....

    • UNIXX SP760 - Resist spray coating system

    FOR FLAT AND CONCAVE OR CONVEX SURFACES

    SEMI-AUTOMATIC SPRAY COATER

    The osiris spray coating system UNIXX SP760 is a innovative spray coating concept that combines two different spray methods into one system. With the newly developed method of 3D spray technology, for concave or convex (3D) surfaces, as well as the traditional in-line technology (2D) for substrates with topographic structure, we can now coat all topographies and shapes in one system.
    The device has an easy to operate user interface with all needed functions. All necessary media supplies such as CDA, N2 and Vacuum can be plugged in via plug-in connections and are controlled by software.

    BENEFITS

    •  For flat, concave or convex surfaces
    •  Designed for large scale optical devices and different flat substrates sizes
    •  6 axis robot system
    •  Up to two ultrasonic spray nozzles with automatic quick exchange function
    •  Integrated heating chuck
    •  User-friendly operator interface

    Spray coater for all topographies and shapes in one system.

    2D FOR ROUND WAFER SIZE
    from Ø200 mm up to Ø300 mm

    2D FOR SQUARE SUBSTRATE SIZE
    from 9” x 9” up to 21” x 21”

    3D for CONCAVE OR CONVEX SURFACES
    for large scale optical devices up to 300mm high

  • Automatic micro-electronics cluster - VARIXX 804
    The VARIXX 804 system platform offers the customer the possibility to configure the system so that it can be optimally equipped for the required process....

    • VARIXX 804

    AUTOMATIC MICRO-ELECTRONICS CLUSTER SYSTEM

    The OSIRIS system platform offers the customer the possibility to configure the system so that it can be optimally equipped for the required process.
    This VARIXX 804 automatic cluster system can be equipped with spin or spray coat and developer process modules, HMDS (vapor primer), hotplates and cool-plates for wafer sizes Ø2" /50mm up to Ø8" /200mm or square substrates up to 6” x 6” / 150 x 150 mm.
    One precise and fast running robotic are able to handle very thin fragile substrates very gently. With our system control unit via a 22" touchscreen display is used for optimum control and monitoring of the machine.

    BENEFITS

    • Substrate sizes up to 200mm (round) or 6"x 6" (square)
    • Flexible configuration of process modules
    • Dual arm robotic system for increasing throughput
    • On-the-fly product alignment
    • Full edge handling (backside protected) or standard vacuum gripping
    • Handling for thin, standard or bonded wafer (Si, glass & others)
    • SECS/GEM interface
    • Standard and customized chuck design

  • Photomasks etching & cleaning system - CHEMIXX E30
    Semi-automatic high performance etching & cleaning system for single substrate wet processing....

    • CHEMIXX E 30

    PHOTOMASKS OR WAFERS ETCHING & CLEANING SYSTEM

    PROCESSING OF PIRANHA (SPM) AND SC1.

    Semi-automatic high performance etching & cleaning system for single substrate wet processing.

    This CHEMIXX E 30 etching & cleaning system designed to provide users in industry with a productive and safe system. Also, the low life cycle cost (LCC) is a good reason why we recommend this equipment.
    The tool has an easy to operate user interface with all needed functions like, recipe programming, service, maintenance and user administration.
    In the design and construction of this system, great value was attached to safety and user friendliness.

    BENEFITS

    • Semi-automated system with manual loading and unloading
    • Masks size (square substrates) up to 230 x 230 mm / 9 x 9 inch
    • Wafer size up to 300 mm (Ø12 inch)
    • Up to two electric media arms
    • Media arm for 6 media lines
    • Wide range of nozzles available
    • Low contact or customized chucks
    • Heated media lines: 20 - 80°C
    • Chamber rinse nozzle system
    • Manual DI-water gun
    • Integrated media cabinet for max. 3 canisters (each 10ltr.)
    • OPTIONAL: External media cabinet for different chemicals e.g.(H2SO4, H2O2, NH4OH, HF, BOE)

    TYPES OF NOZZLES

    Aqueous based chemicals;
    Equipped for chemical processing via:
    1. Puddle or spray nozzle
    2. 5-hole puddle nozzle
    3. Atomizer nozzle
    4. BSR (Back side rinse) nozzle

    Equipped for mechanical processing via:
    1. Brush system
    2. High pressure
    3. Megasonic nozzle

Categories

200 Packaging and Assembly Equipment
  • Die Bonding; Attach Equipment
  • Dispensing Systems
  • Litho for WLP: Bumping; 3D Interconnect Aligners
  • Wafer Mount; Taping Equipment
    • 201 Flat Panel Display Equipment
  • Alignment Film Coating Equipment
  • Liquid Crystal Injection or Filling Equipment
  • Spacer Spraying Equipment
    • 202 Other Equipment
  • Vacuum drying & out gassing Systems
    • 204 MEMS Equipment
  • Deep RIE etching; Dry Etching
  • Wafer Level Bonders
    • 205 Nanotechnology Equipment and Tools
  • Equipment, Nanotechnology Tools
    • 207 Process Equipment
  • Chemical Mechanical Polishing
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Coat; Develop; Resist Processing; Track Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Lithography/Exposure
  • SOI Bonders; Temporary Bonders; De-Bonders
  • Spin on Glass (SOG); on Dielectric (SOD) Track systems
  • Thermal Processing
  • Transfer Systems for Wafer; Reticles or FPD's
    • 400 Components, Parts & Accessories
  • Chucks for Wafer and other Substrates
    • 401 Sub-systems
  • Pumps, for Fluids
  • Pumps, Vacuum
    • 502 Material Handling Systems
  • Conveying; Material Handling Systems

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