Discover SET high post-bond accuracy FLIP-CHIP BONDERS!
Founded in 1975, SET - Smart Equipment Technology - based in Saint-Jeoire, France, is a world leading supplier of High Accuracy Flip-Chip Bonders (Die-to-Die and Die-to-Wafer).
With more than 340 Device Bonders installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its Flip-Chip Bonders.
The SET Bonders adapt to all main bonding techniques: fluxless reflow, adhesive joining compression and thermosonic.
SET’s newest generation of bonder, the ACCµRA family, guarantees the highest bonding accuracy (± 0.5 µm) and quality for the most demanding applications: image sensors, 3D IC with high density TSV, MEMS and optoelectronics applications...
SET encompasses a subsidiary in North America and offers a comprehensive product portfolio of Flip-Chip Bonders for fast growing markets and serving clients through a global network of representatives and in-depth customer trainings.
Discover our range of FLIP-CHIP BONDERS: ACCµRA100, ACCµRA OPTO, ACCµRA M and ACCµRA Plus!