Logitech Ltd.

The LP70 multi-station precision lapping and polishing system is a bench-top machine designed to
run concurrent automated processes, allowing operators to achieve repeatable results to stringent sample specifications. With four workstations as standard, this system is the optimal solution for both production and research laboratories.

Key features:

• Four station machine with a wafer process capacity of up to four 100 mm / 4" or two 150 mm / 6"
• Plate speeds up to 100 rpm facilitating faster lapping rates
• Bluetooth enabled features: real time data collection and feedback from jigs allowing for greater end-point thickness control for increased accuracy
• Automatic plate flatness control
• Real time data collection and feedback via Bluetooth to allow users to export data via USB port for external analysis
• Recipe mode allows to create and store recipes for easy process repeatability
• Option for chemically resistant to standard chemicals used in CMP applications
• In-situ cleaning via integrated, sample cleaning, de-ionised water and nitrogen/compressed dry air (CDA) mixer spray gun

The MWBS offers a bonding capactiy of small pieces of wafers and wafer sizes, from 2" up to 8" wafers. The modular design allows for up to 12 heads (with the capacity for expansion) from one single control unit. This saves valuable bench space and allows for easy, synchronous and asynchronous processing. 

Due to the fully expandable modular design of this system, it is ideal for both R&D and production level facilities. Allowing a cost effective solution the system is fully tailored to the exact bonding and throughput requirements of the customer.

Key features:

• Wafer process capacity of small wafer pieces and wafer sizes from 2" up to 8" per bonding head.
• Modular design with expansion capacity allowing a cost effective solution tailored to your exact bonding and throughput requirements.
• Control up to 12 bonding heads (with the capacity for expansion) from a single control unit, saving valuable bench space and allowing for easy synchronous and asynchronous processing.
• Consistent bond thickness and excellent dimensional accuracry due to precise control and felxible diaphragm within the bonding chamber.

The PM6 Precision Lapping & Polishing system produces results typically found on production scale equipment. Highly flexible in use, the PM6 allows users to work with many different
materials including; gallium arsenide, silicon, silicon carbide and indium phosphide. This system provides the ability to produce specimens repeatably with superior quality and surface finish. Precise plate set up options combined with an intuitive control system provide an effortless consistency of results with a very high degree of accuracy. Wherever there is a need for a controlled flat surface with a high quality finish the PM6 makes an invaluable investment. The PM6 system offers enhanced process performance through a combination of innovative designs and intuitive operator controls.

Key features:

• Single workstation with a wafer process capacity of u to 4"/100mm - driven jig roller arms greatly increase accuracy and repeatability.
• Bluetooth automatic plate-flatness control provides continuous in-situ measurement of the plate flatness and automatically corrects any deviation set by operator.
• Bluetooth-enabled features include; real time data collection and feedback from the PP series jigs allowing greater end-point thickness control for increased accuracy.
• Plate speed up to 100rpm which facilitates faster lapping and polishing rates.
• Recipe mode allowing users to create, save and re-call multi-stage recipes to allow for easy process repeatability.
• Option for a PM6 chemically resistant to standard chemicals used in CMP applications.
• In-situ sample cleaning via the integrated de-ionised water and nitrogen gun.