TDK Corporation of America
Welcome to TDK featuring Purge Equipment Front End Module!
TDK is the leading manufacturer of factory automoation equipment
Visit the TDK booth to view a live demonstration of our products on display:
TDK Corporation product highlights at the show include:
AFM 15 Flip Chip Gold to Gold Interconnect Die Bonder:
TDK will feature its AFM GGI flip chip model with horn capability for an even smaller die size of 80mm2 up to 20mm2. TDK horn design provides linear X-Y nozzle movement over a wide range of ultrasonic power settings. Z-axis movement has been reduced by 90 percent during the GGI bonding process. The TDK GGI AFM 15 flip chip die attachment process is a clean, lead-free, precision back end assembly process with low cost of ownership and high productivity. TDK’s AFM 15 can be used for die interconnect assembly of Driver IC, Micro LED, Opto, RF Filters, and MEMS devices.
TDK TAS PLP Load Port for FO-PLP Panel Level Packaging
TDK has more than 18 years of experience with clean precision load port operation in all major fabs. The TDK TAS-PLP load port is based on our proven load port reliability required by fabs. TDK began TAS PLP qualification work in 2016 and volume production in 2018. The TDK TAS-PLP load port incorporates SEMI Standard 450 table design with TDK’s fab leading cleanliness standard. TDK TAS PLP load port operates with 24VDC and air cylinder table actuation to meet the low cost of ownership requirement by fabs. The TDK TAS PLP load port can handle panel sizes of 500mm ~650mm. TDK Options include N2 purge, panel mapping, and ethernet.
TDK 200mm SMIF Loader and Open Cassette Loader for Expanding Fab Growth:
TDK’s TAS-SMIF and Open Cassette load port addresses 200mm fab requirements for low operational costs, and cleanliness. TDK uses a 300mm bolts interface to allow installation using current EFEM design. TDK 200mm SMIF and 200mm Open Cassette design uses a base 300mm load port and 300mm tool software interface. TDK Options include CID, wafer mapping, and ethernet.