Sikama International's EA UP1200TM is a continuous flow, fluxless oven capable of residue free bump reflow using activated hydrogen. The EA UP1200 uses Sikama's unique patented "thermal technology" that is based in combination with forced thermal convection heating and radiant heating of the work items. In addition, it incorporates an electron attachment environment to provide unmatched fluxless soldering performance.
The EA UP1200 system has eight (8) work zones internal to the oven: six (6) heat zones and two (2) cooling zones. In addition there is a load zone and an unload zone. The heat and cool zones have both top and bottom heating/cooling elements. The heating and cooling zones utilize the Sikama contact thermal transfer for the bottom elements and combined convection and radiant thermal transfer for the top elements. The load/unload zones can operate in local mode or can be integrated into a flowing process using SMEMA or SECS/GEM connectivity to other process machinery. The system may be operated with cover gases such as nitrogen or forming gas. Each cooling and heating zone is independently temperature controlled permitting a complex thermal profile to be used in the reflow or curing process.
The EA UP1200 can be operated “stand alone” using the operator control panel on the front of the machine or it can be controlled using the Sikama Integrated Control Software running on a Microsoft Windows based PC computer. The computer is connected to the EA UP1200 via an RS232 interface cable.