Through careful and uniform injection of the plating electrolyte near the surface and the linearization of the electric field this system makes fine line plating feasible on very large substrates.
PR-strip / PR-Development / UBM etch
Knowing that plating is just one step in the whole wet process of the panel, the system enables
PRstrip, PR-development and etch processing for all kinds of panel sizes and different panel materials.
Wafer double side processing
The processing platform also allows double side processing of wafers.
VHS-P CUSTOMER ADDED VALUES
- Deposition of extremely uniform metal structures.
- Reliable platform for fine-line plating on large substrates up to Gen5.1
- Customized to specific processing requirements
- Two substrates processed at once per chamber for higher throughput
- Full suite of wet processes for RDL packaging applications
- Modular platform, upgrade- and future-proof
- Processing of substrates from 300x300mm² up to 1200x 1300mm (Gen5.1)
- Processing of wafers up to 450mm wafers, up to 300mm Taiko wafers with Bernoulli handling
- Patented HSP (high speed plating) technology for highest throughput and utmost uniformity
- Industry 4.0 ready – control and monitor all process parameters
- Plating uniformity 5% or better
- Etch uniformity 5% or better
- Online dosing and chemical monitoring system
- Online gas detection for safety
- Multipoint end-point detection system for etch process