SEMSYSCO GmbH

The SEMSYSCO TRITON platform is a stable but modular workhorse for all single-wafer wet-processes. The modular build of the Tool enables to configure it for mass-production, single-process tool as well as a R&D or prototyping tool

The Tool can be configured with fountain or HSP plating system with upper chamber for pre-wet and  rinse and dry above the plating chamber. Membrane chamber technology allows to significantly reduce costs of plating chemistry.

Tools can be made ready to support additional chambers and tanks, so it will grow with process requirements. Modular and future oriented design allows newly developed chambers to be added to existing tools with space for expansion.

TRITON CUSTOMER ADDED VALUES

• Possibility of processing two to three different substrate sizes with minimal or no reconfiguration – and no requalification of the chamber
• Excellent speed and quality track record
• Customizable and future-proof
• Possibility of processing more than one substrate size per chamber with minimal reconfiguration
• Modular platform
• Established high-throughput processing chambers

TRITON HIGHLIGHTS

• Processing of 3” to 450 mm substrates
• Patented High-Speed Plating for better throughput and better uniformity – without changing the chemistry
• Industry 4.0 ready – control and monitor all process parameters
• Plating uniformity 3% or better
• Etch uniformity 3% or better
• Multipoint end-point detection system for etch process
• Online dosing and chemical monitoring system
• Online gas detection for safety
• End-point detection system for etch process

The modular approach allows single chamber manual tool to up to eight chambers fully automated platform with solvent or acid processing chambers. Within the same tool carriers for manual cassette loading and change over to guardian carriers for full automation is possible. By changing the carrier different substrate sizes can be processed.

GALAXY E-Less Plating

An additional feature is the adding on of immersion tanks to allow the electro-less deposition of metals. The GALAXY-EL features pre-treatment, rinse-dry batch chambers as well as the tanks necessary to deposit metals very thin and very homogeneously, while offering superior bath life, minimal drag out and excellent uniformity.

GALAXY CUSTOMER ADDED VALUE

• Identical chambers for manual and fully automated tools in the modular platform
• Outstanding automation reliability and speed
• Possibility of processing more than one substrate size per chamber with change of carrier
• Electroless plating optional
• Upgrade- and future-proof
• Established high-throughput processing chambers

GALAXY HIGHLIGHTS

• Processing of 3” to 300 mm substrates
• Possibility of processing two to three different substrate sizes with minimal or no reconfiguration – and no requalification of the chamber
• Industry 4.0 ready – control and monitor all process parameters similar to a single wafer tool
• Etch uniformity 3% or better
• Online dosing system
• Online chemical monitoring
• Online gas detection for safety
• End-point detection system for etch process
• Ready to start prototype application as well as mass production processe

Electrochemical Deposition

Through careful and uniform injection of the plating electrolyte near the surface and the linearization of the electric field this system makes fine line plating feasible on very large substrates.

PR-strip / PR-Development / UBM etch

Knowing that plating is just one step in the whole wet process of the panel, the system enables
PR­strip, PR-development and etch processing for all kinds of panel sizes and different panel materials.

Wafer double side processing

The processing platform also allows double side processing of wafers.

VHS-P CUSTOMER ADDED VALUES

• Deposition of extremely uniform metal structures.
• Reliable platform for fine-line plating on large substrates up to Gen5.1
• Customized to specific processing requirements
• Two substrates processed at once per chamber for higher throughput
• Full suite of wet processes for RDL packaging applications
• Modular platform, upgrade- and future-proof

VHS-P Highlights:

• Processing of substrates from 300x300mm² up to 1200x 1300mm (Gen5.1)
• Processing of wafers up to 450mm wafers, up to 300mm Taiko wafers with Bernoulli handling
• Patented HSP (high speed plating) technology  for highest throughput and utmost uniformity
• Industry 4.0 ready – control and monitor all process parameters
• Plating uniformity 5% or better
• Etch uniformity 5% or better
• Online dosing and chemical monitoring system
• Online gas detection for safety
• Multipoint end-point detection system for etch process