ASM Pacific Technology (Americas)

97E. Brokaw Rd
Suite 100
San Jose,  CA  95112

United States
  • Booth: 839

Welcome to ASM Pacific, your assembly solutions partner

ASMPT manufactures materials & equipment for the assembly of IC, COB, COG, CIS, OPTO, Power & LED products

Materials include:


- Stamped LFs

- Etched LFs


Equipment includes: 

- Die bonders for Epoxy, Eutectic, Solder, FlipChip & TCB Processes

- Lens Holder bonder & AutoFocus system for CIS assembly

- LED Die Probers & wafer map Sorter

- Integrated LED tester

- Wire bonders for Aluminum/Gold Wedge

- Wire bonders for AU/CU/AG Ball and AU/CU Stud bumps

- Encapsulation systems for ICs w/ strip, Reel-Reel, wafer level processing

- Silicon Liquid Molding for LEDs

- Trim/Form/Singulation systems for leadframes

- Saw/Sort/Singulation systems for QFN/CSPBGA applications

- Test Handlers for LED and IC singulated units (turret handling)

- Integrated test for Strip & Matrix handling

- Laser Mark handling systems for strip based stand alone laser marking

- Solder Ball Attach & reflow ovens

- Dispense/Jetting Systems for Underfill/Gloptop/Phosphor processing

- Epoxy Cure & solder reflow ovens

- Laser Dicing systems

- LowK Wafer Grooving

- ECD & PVD Systems for Advance Packaging

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