July 12-14, 2016
San Fransisco, CA
We are the bonding experts! Please contact us.
Surfx Technologies will be attending SEMICON West in San Francisco from December7 th to 9th. We will be at booth 364. We will have live demos of our new in-line plasma system. Please bring your microelectronic packages to clean and activate for bonding. Contact Alan Vucetic (email@example.com) to set aside a time for sample testing. Our atmospheric pressure argon plasma is the only machine capable of removing organic and metal oxide contamination without damaging your delicate microwave circuits. Our argon plasmas are fast, safe and particle free. Integration into die bonders, wire bonders and molding machines is straightforward. We also offer turnkey systems that will drop right into your semiconductor packaging line.