TSE Co., Ltd.

189, Gunsu 1-gil, Jiksan-eup, Seobuk-gu,
Cheonan-si,  Chungnam  31032

Korea (South)
http://www.tse21.com
  • Booth: 1631


Semiconductor Total Test Solution

The Best Partner, TSE!


"Delivering the promise of value-added innovation and technology to test."


TSE has been grown up with semiconductor industries since TSE was founded in 1994. TSE has developed test interface system, load board, test socket and probe card which are necessary for semiconductor test and has supplied to semiconductor chip makers worldwide.

Moreover, TSE has creates true value together with the customers by developing various types of TOB( Tester On Board) which improve the performance of existing ATE system. TSE operates MEMS production line, and produces wide range of products. the product items are MEMS Probe Card, MRC(MEMS Rubber
Socket), OLED MEMS Unit, MEMS Inductor, MEMS Relay, etc.


TSE supplies load board and test sockets required for SoC and Logic semiconductor devices, but also supplies handler equipment.
Based on those technologies, TSE contributes all our effort continuously to be a company to create new value consistently together with customers. We ask you a favor of your warm support and interest to TSE which makes a new take-off.

 Products

  • Load Board & Socket
    Load board is an interface board to test SOC package such as CPU, Chipset, GPU and AP. TSE is providing high speed, high performance load board to the major semiconductor customers like Intel, Samsung and AMD in worldwide....

    • Load Board

    1. The most innovative Design Rule based on SI/PI Simulation

    2. The most advanced Fab technology for PCB manufacturing 

    Pitch(mm) 0.5 pitch 0.4 pitch 0.35pitch 0.3pitch
    Class Standard Advanced  Eng.  Standard Advanced  Eng.  Standard Advanced  Eng.  Standard Advanced  Eng. 
    Thickness(mm) 4.8 6.35 7.4 4.2 5.0 6.35 3.2 4.0 5.2 2.0 3.4 3.8
    Aspect Ratio 24 32 37 28 33 42 26 32 42 20 32 36
    Back Drilling Depth 4.5mm 4.0mm 3.5mm 3.0mm
    Back Drilling Stub 0.05mm ~ 0.25mm (0.15mm ± 0.1mm)
    Max Board Thickness Standard 6.35mm, Advanced 7.4mm, Engineering 8mm

    Socket

    0.80mm pitch Spring Pin Elastomer ELTUNE-Coax
    Over-drive 0.40 0.25 0.25
    Test height 3.50 0.60 0.60

    42.5Ω, 0.80mm pitch Spring Pin Elastomer ELTUNE-Coax
    Insertion
    Loss S21
    @-1dB    		 Single Ended
    (G-S-G)    		 13.93 27.81 >100
    Differential
    (G-S-S-G)    		 25.39 28.94 >100
    Return
    Loss S11
    @-10dB    		 Single Ended
    (G-S-G)    		 10.98 15.89 >100
    Differential
    (G-S-S-G)    		 20.77 25.22 48.21
    Crosstalk
    S31, @-20dB    		 G-S-S-G 8.50 9.43 >100

  • Probe Card (HPC & VPC)
    High Performance Probe Card...

    • HPC

    · High Parallel Test solution upto 2500para.
    · High probe counts
    · Wide teperature application  -40℃~125℃
    · Single Temp. Application solution
    Short Initial preheating time
    Allowable Long Chuck idle time (≤30Min)
    Stable Contact Mark
    · High Speed application
    With non channel sharing 1.8Ghz is applicable

    VPC

    Itmes Cu-Pillar Bumps (Flat Tips) AI Pads (Pointed Tips)

    Min Pitch (Full Array)

    		 ≥110 µm ≥90 µm ≥80 µm ≥50 µm ≥110 µm ≥50 µm
    Probe Name VW-150H VW-90 VW-80 VW-50 PC-014 PW-002
    Force @3mils OT 3.5g 2g 2g 1.5g 4.5g 2.5g
    Pin Current (CCC) ≥1.4A ≥1.1A ≥800mA ≥450mA ≥650mA ≥450mA

  • STO-ML
    · Multi Layered Organic Substrate · Thin Film by MEMS process...

    • Item Fab Capability 
    STO STO-ML
    C4 Ptich 100µm 40µm
    Board Size 100x100mm 65x65mm
    Board Thickness

    3.0mm ± 0.2mm (Max. 3.2mm)
    Stack Up 15-N-15 3(ML)-15-N-15
    C4 Pad Size 80µm 30µm
    Micro Via Size 50µm 18µm
    Stacked Via 5 times 3 times
    Stacked Layer 15 times 3 times
    C4 Plating ENIG, Hard Gold Hard Gold

Categories

208 Test Equipment
  • Logic Test Systems
  • Memory Test Systems
  • Package Test Systems
  • PCB; Wire Board (PWB) Test and Repair
  • Probe Card Maintenance and Analysis Systems
  • Probing: Analytical; Circuit; Manual; E-Beam; Optical; Wafer
  • System on a Chip (SOC); Mixed Signal Test Systems
    • 309 Test Materials
  • Boards: Burn-In; Performance (Low/High Temp and Ceramic)
  • Probe Cards; DUT boards and other probing accessories
  • Structural Circuits; Test; Thermal Fixturing
  • Test Sockets; Contactors and Contact accessories

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