ASM Pacific Technology (Americas)
Welcome to ASM Pacific, your assembly solutions partner
ASMPT manufactures equipment for the assembly of IC, COB, COG, CIS, OPTO, Power & LED products
Equipment includes:
- Die bonders for Epoxy, Eutectic, Solder, FlipChip, Silver Sintering & TCB Processes
- Lens Holder bonder & AutoFocus system for CIS assembly
- LED Laser Dicers, Die sorters, Die and Wire Bonders
- Wire bonders for Aluminum/Gold Wedge
- Wire bonders for AU/CU/AG Ball bonding and AU/CU Stud bumping
- Encapsulation systems for ICs w/ strip, Reel-Reel, wafer level processing
- Trim/Form/Singulation systems for leadframes
- Test Handlers for IC singulated units (turret handling)
- Epoxy Cure & solder reflow ovens (as a part of ASM Integrated Assembly Lines
- Laser Dicing systems
- LowK Wafer Grooving
- ECD & PVD Systems for Advance Packaging