TDK Corporation of America
Welcome to TDK, leaders in factory automation equipment!
AFM 15 Flip Chip Gold to Gold Interconnect Die Bonder:
TDK AFM GGI flip chip model with horn capability for an even smaller die size of 80mm(sq) up to 20mm (sq). TDK horn design provides linear X-Y nozzle movement over a wide range of ultrasonic power settings. The TDK GGI AFM 15 flip chip die attachment process is a clean, lead-free, precision back end assembly process with low cost of ownership and high productivity.
TDK TAS PLP Load Port for FO-PLP Panel Level Packaging
The TDK TAS-PLP load port is based on our proven load port reliability required by fabs. The TDK TAS-PLP load port incorporates SEMI Standard 450 table design with TDK’s fab leading cleanliness standard. The TDK TAS PLP load port can handle panel sizes of 500mm ~650mm. Options include N2 purge, panel mapping, and ethernet.
TDK 200mm SMIF Loader and Open Cassette Loader for Expanding Fab Growth:
TDK’s TAS-SMIF and Open Cassette load port addresses 200mm fab requirements for low operational costs, and cleanliness. TDK uses a 300mm bolts interface to allow installation using current EFEM design. TDK 200mm SMIF and 200mm Open Cassette design uses a base 300mm load port and 300mm tool software interface.