July 12-14, 2016
San Fransisco, CA
Welcome to TOWA eBooth, please connect with us!
TOWA is a leading company in the semiconductor molding equipment market. We offer equipment using our high quality / flow free compression molding method and our proven transfer molding method. We also manufacture ultra-precision molds that have been highly acclaimed by customers. Together with our molding equipment, our singulation system was developed from both aspects of the dicer and product handler to provide the optimal method of singulation for each product type. The result is high quality cutting whilst improving customers' productivity with high throughput.
Located in the heart of the Silicon Valley, our TOWA USA's San Jose Package Development Center was established to support customers’ development programs. Our activities are centered around Compression and Transfer Molding for Advanced Packaging and we collaborate with a broad spectrum of industry members from IDMs, OSATs, Fabless Companies, Government Contractors, Technical Institutes and Consortiums. Please contact us for more information.