USHIO is a leading supplier of lithography tools for 3D, 2.5D, 2.1D packaging, packaging substrates, LEDs, MEMS devices, and power devices.
At SEMICON 2014, USHIO exhibits the following four products of its UX Series lithography tools:
UX7-3Di LIS350: Next-Generation 3D Memory bumping and 2.5D Si Interposer stepper for 300mm wafers, with 2 µm L/S resplution and 120 wph or 90 pph throughput.
Square 70: Panel stepper for 2.1D, 2.5D Organic/Glass Interposer, capable of handling upto 405 x 350mm panel, with resolution of 3/3 L/S with DFR on Organic panel.
Align 600: Maskless Scanner for next-generation FC-BGAs and FC-CSP that covers the industry's future roadmap of 5um L/S resolution and with maximum 600 alignment points capability.
UX4 Series: Large-area full-field projection lithography tools optimum for MEMS devices, high-brightness LEDs, power devices, and WL-CSPs
USHIO leverages the industry’s most advanced development capabilities to meet the increasingly divergent product requirements of the industry.