Besi (BE Semiconductor Industries N.V.)

33 East Comstock Drive
Suite 4
Chandler,  AZ  85225

United States
http://www.besi.com
  • Booth: 431

Besi invites you to our booth #6162 - Semicon West 2018.

Continuing our tradition as a leading advanced packaging semiconductor manufacturing solutions provider, we take great pride in sharing our latest technology for

  • Thermal Compression Bonding (TCB)
  • Die Attach
  • Multi Chip and Component Die Attach
  • Flip Chip
  • Molding
  • Saw Singulation
  • Trim & Form
  • Plating Equipment. 

We look forward to seeing you and allowing us to show you how BESI’s solutions in advanced packaging can meet your manufacturing needs.  

Categories

101 Photovoltaic Device Manufacturing
  • PV: Modules
  • PV: Stand-Alone Systems
  • Solar Thermal
    • 206 PV Equipment
  • Modules
  • Other
    • 700 Manufacturing Services
  • Repair; Rebuild; Install Equipment; Maintenance Svcs; Spares
    • 200 Packaging and Assembly Equipment
  • Cut & Down Set; Trim; Form Equipment
  • Deflashing; Degating Tools
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Lead Finishing; Straightening Equipment
  • Molding; Encapsulation; Decapsulation Equipment
  • Plating; Electro Chemical Plating for device assembly
  • Wafer Level Bonders
  • Wire Bonding Equipment
    • 202 Other Equipment
  • Molding; Encapsulation; Decapsulation Equipment
    • 204 MEMS Equipment
  • Wafer Level Bonders

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