The HVM Metrology Cell with dual CT300 or CT350T units and a common handler provides true metrology capabilities at production speeds. The compact integration of a dual endeffector wafer handler with two high performance metrology systems offers unparalleled metrology throughput per unit of fab floor space. Multiple sensor technologies can be selected to provide superior operational flexibility for the control of a large number of process steps.
Fully integrated with our automation software, the Metrology Cell can measure wafer thickness, TTV, warpage, stress, bump size, feature/bump position vs nominal, bridging, missing bumps, sub-nm roughness, film thickness down to 10 nm and much more.
Contact us for a detailed discussion on how this metrology platform can provide more efficiency and comprehensive metrology capabilities for your process control.