Sumitomo Bakelite Co., Ltd.

Epoxy molding compounds for encapsulation of semiconductor device, which protect delicate semiconductors from moisture and shock, are one of our leading products. We realize smooth supply worldwide thorough our four-country, four factory production system (Japan [Kyushu], Singapore, China, and Taiwan). We have released the EME-G series and E series materials, which do not contain brominated flame retardants, and are otherwise working to reduce the environmental load.

Based on our technology that accumulated in epoxy molding compound for encapsulation of semiconductor devices, we developed the electronic control unit (ECU) direct molding material for automobile which is required the resistance to high temperature and severe environment and high reliability. In applying to ECUs such as fuel injection electronic control, our material contributes to large downsizing, light weighting and price reduction compared to the conventional resin case type ECU.

We launched the world’s first mass production of positive-type photosensitive coating resins in 1997. Our products have won high acclaim in meeting many customers’ needs with superior properties of high resolution, strong adhesion, low water absorption, and environmental safety. This products are used for Wafer buffer coating as well as RDL.

The LaZ series of substrate materials for semiconductor packages features the high reliability, low thermal expansion, and superior dimensional stability one would expect from our technological strengths as the world leader in semiconductor materials. Meeting high-density packaging and fine-pitch wiring requirements, our substrate materials support all types of leading electronic equipment.