July 12-14, 2016
San Fransisco, CA
Founded in 1965
The FALIT™ systems provide Decapsulation (etching) and Cross-sectioning of semiconductors for failure analysis labs. Our IC laser etching systems are used in many semiconductor failure analysis labs to remove mold compound, de-lid semiconductor hermetically-sealed cases, remove various gels, and cross-section ICs for further inspection. Our patented process has been refined over the 10-plus years since it’s existence.
For decapsulation, you will want to look at our latest technology, the Digital ICO™ laser. This specialized laser source is the key to uncovering mold compound all the way to the die in some cases. Digital ICO™: Gets you closer.
Our latest technology for the semiconductor industry, the RETINA™ (counteRfEiT semIcoNductor lAser), is able to selectively remove either microns, or millimeters, of semiconductor mold compound, in seconds, in an effort to uncover sanding marks, ghost marks, and other tell-tale signs of a counterfeit semiconductor without the use of harsh and hazardous chemicals as used with the Heated Solvent Test.