The MWBS offers a bonding capactiy of small pieces of wafers and wafer sizes, from 2" up to 8" wafers. The modular design allows for up to 12 heads (with the capacity for expansion) from one single control unit. This saves valuable bench space and allows for easy, synchronous and asynchronous processing.
Due to the fully expandable modular design of this system, it is ideal for both R&D and production level facilities. Allowing a cost effective solution the system is fully tailored to the exact bonding and throughput requirements of the customer.
- Wafer process capacity of small wafer pieces and wafer sizes from 2" up to 8" per bonding head.
- Modular design with expansion capacity allowing a cost effective solution tailored to your exact bonding and throughput requirements.
- Control up to 12 bonding heads (with the capacity for expansion) from a single control unit, saving valuable bench space and allowing for easy synchronous and asynchronous processing.
- Consistent bond thickness and excellent dimensional accuracry due to precise control and felxible diaphragm within the bonding chamber.