July 12-14, 2016
San Fransisco, CA
1. Free of microcracks, chipping, induced stress or etc.
2. Smooth inside walls of micro holes
3. Ultra-dense micro holes
4. Miniaturization and integration of devices
1. Improved hermeticity by high-level filling and void-less
2. Uniform Cu plating around the inner wall with various hole shapes
3. We can make consistent proposals from fine hole processing to Cu plating.
1. Approximately 90,000 to 200,000 Micro-Fins/㎠ - Instantly increase surface area 2-3 times by electrodeposition method
2. Projection shape with a height of 5μm or less - Can be processed into any shape and various materials
3. Establish high productivity - Achieves low cost and mass production with a unique construction method