MAGAZINE
March
Larg Weiland of PDF Solutions Wins Si2 Pinnacle Award
Larg Weiland, a technical fellow at PDF Solutions, has been honored with the quarterly Silicon Integration Initiative Pinnacle Award, which is presented for exceptional contributions to Si2’s success as a leading semiconductor research and development joint venture.
Imec.xpand Launches EUR 300M Fund Amid Global Race for Semiconductor Supremacy
Imec.xpand, an independent global venture capital fund, today announced the launch of a new EUR 300 million fund aimed at accelerating the growth of transformative semiconductor and nanotechnology innovations.
Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU
Synopsys, Inc. today announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry’s latest Gate-All-Around (GAA) process technologies.
mechatronic systemtechnik GmbH Unveils Technology Center in Fürnitz
mechatronic systemtechnik GmbH (mechatronic), a global supplier of automation equipment for critical wafer handling, announced the opening of its new cutting-edge technology center in Fürnitz.
Semiconductor CMP Pad & Slurry Forecast
CMP consumables for metals to see large growth over next 5 years.
The Flipping Future: Advancements in Flip Chip Packaging
Flip chip technology makes it possible to replace conventional wire interconnections with a direct and strong bond between chips and substrates. The future of silicon packaging is anticipated to be significantly influenced by flip chip technology to satisfy the increasing need for electronics that are faster, smaller, and more efficient.
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
Research published in Nature demonstrates high qubit control fidelity and uniformity in single-electron control.
Purdue-Created Technology Makes 3D Microscopes Easier to Use, Less Expensive to Manufacture
3D microscopes are used in applications from the life sciences to semiconductor manufacturing. Now Purdue engineers are developing patented and patent-pending innovations making them work faster to capture even more 3D images and less expensive to manufacture.
Rogue Valley Microdevices’ Unveils 300mm MEMS Capability at its Upcoming Palm Bay, Florida Facility
CEO Jessica Gomez presents this week at the MEMS & Sensors Technical Congress.
Morse Micro Expands Presence in Taiwan with New Office
Morse Micro today announced the official opening of its new Taiwan branch.
Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
Worldwide silicon wafer shipments decreased 5.4% quarter-over-quarter to 2,834 million square inches in the first quarter of 2024.
2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies
The world’s leading forum for unveiling, discussing and exhibiting the latest advancements in microelectronics packaging and component science and technology is the IEEE Electronic Components and Technology Conference (ECTC).
Women MAKE Awards Recognizes GlobalFoundries’ Jennifer Robbins and Katelyn Harrison for Manufacturing Excellence
Last week, the Manufacturing Institute (MI)—the workforce development and education affiliate of the National Association of Manufacturers—honored two outstanding women from GlobalFoundries at their annual Women MAKE Awards
TSMC Certifies Ansys Multiphysics Platforms
Ansys today announced the certification of its power integrity platforms for TSMC’s N2 technology full production release.
StratEdge Takes High-Frequency Packaging Technology to New Heights at Upcoming Events
StratEdge Corporation is set to showcase its latest packaging technology for high-frequency applications at several industry conferences in May.
Great Strides in the Development of High Refractive Index Polymers for Optoelectronics
Researchers report a novel family of low-cost, sustainable polymers that could be useful for modern displays, photodetectors, and lighting devices.
Nordson Electronics Solutions Receives EM China Innovation Award
Nordson Electronics Solutions received the conformal coating equipment award from EM Asia China for the new ASYMTEK Select Coat SL-1040 conformal coating system, at an award ceremony during Productronica China, held March 21 in the Shanghai New International Expo Centre, Shanghai, China.
AMD’s Dr. Lisa Su Named Chief Executive Magazine’s 2024 CEO of the Year
Chief Executive magazine today announced that Dr. Lisa Su, CEO of AMD, has been named 2024 Chief Executive of the Year by her peer CEOs.
Gstar Announces Groundbreaking of Silicon Wafer Factory Construction in Indonesia
Recently, Gstar held a groundbreaking ceremony for its silicon rod and silicon wafer factory, marking the beginning of the rapid construction phase.
Celestial AI Announces Appointment of Diane Bryant to Board of Directors
Celestial AI, creator of the Photonic Fabric optical interconnect technology platform, today announced the appointment of Diane Bryant to the Company’s Board of Directors effective April 11, 2024.
Guerrilla RF Completes Strategic Acquisition of GaN Device Portfolio from Gallium Semiconductor
Guerrilla RF, Inc. has finalized the acquisition of Gallium Semiconductor’s entire portfolio of GaN power amplifiers and front-end modules.
Design Strategies Toward Plasmon-Enhanced 2-Dimensional Material Photodetectors
A research group from Southeast University provided a detailed overview of plasmon-enhanced 2D material photodetectors, mainly focusing on the clarification of different hybridization modes between plasmonic nanostructures and 2D materials.
Revolutionizing Memory Technology: Multiferroic Nanodots for Low-Power Magnetic Storage
In a significant milestone for multiferroic memory devices, a team of researchers led by Professor Masaki Azuma and Assistant Professor Kei Shigematsu from Tokyo Institute of Technology in Japan has successfully developed nanodots with single ferroelectric and ferromagnetic domains.
Featured Video
Is your semiconductor plant seeking methods to enhance sustainability in wafer manufacturing and water reclamation? The semiconductor sector faces two challenges: waste reduction and water usage. The use of on-line water analytics can assist in overseeing water quality in both wafer manufacturing and reclamation/reuse procedures. This video underscores the significance of monitoring the levels of conductivity, TOC, and microbes to identify impurities that may lead to rejected wafers. Monitoring these parameters also ensures the purity of water to improve wafer quality and yield. Furthermore, this video emphasizes the importance of monitoring the levels of dissolved oxygen, TOC, and pH in waste streams to optimize water recovery.
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U.S. Aims for 20% of World’s Leading Edge Semiconductor Production by 2030
Secretary of Commerce Gina Raimondo believes investments in leading-edge logic chips manufacturing will put the U.S. on track to produce roughly 20 percent of the world’s leading-edge logic chips by the end of the decade.
Water Supply Challenges for the Semiconductor Industry
The energy-hungry nature and large carbon footprint of semiconductor manufacturing have received considerable attention in the context of reducing our emissions of planet-warming greenhouse gases. It turns out we are just as thirsty as we are hungry.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What Do Small Companies Need to Know about the CHIPS Act?
IBM’s Poughkeepsie, N.Y. site was the backdrop for one of President Biden’s speeches promoting the passage of the $52B CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, a rare piece of legislation for which the president won bipartisan support.
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
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