Boulder, Colorado: Tech-X Corporation announced the release of the latest version of VSim, a cross-platform, multiphysics simulation tool built on the powerful Vorpal physics engine. VSim 11.0 has significant new features, including an enhanced user interface, a new cut-cell Poisson solver, and a host of new simulation templates and analyzers. The new features in this latest version bring improvements to speed, accuracy, and user workflow, and will benefit users interested in both electromagnetic and kinetic plasma simulation.
User interface: Intuitive and Enhanced
VSim 11.0 was designed with an emphasis on the user experience, and users will notice significant changes to the graphical user interface that make the workflow more intuitive and efficient. In VSim 11.0, users have additional capabilities that allow for increased manipulation of both imported and user-created shapes, which reduces time spent on simulation setup. VSim 11.0 also includes the ability to “heal” flaws that can be introduced when imported CAD files were not generated with the accuracy needed for computational simulation.
Vorpal Engine: Increased Accuracy and Speed
Two significant upgrades to the Vorpal simulation engine can be found in VSim 11.0. Users of the kinetic plasma modules in VSim 11 will benefit from a new cut-cell Poisson solver that decreases simulation time and achieves nearly 2nd order accuracy. For users interested in microwave device simulation, a new benchmarked algorithm for space charge limited emission has the ability to work with conformal shapes and accurately handles complicated cases such as secondary electron emission.
Examples and Templates: Numerous New Additions
In addition to the interface and engine upgrades, new features to assist with workflow and software learning have been added. Newly built-in analyzers and tools are available for processing simulation data, and VSim can now achieve 2nd order accuracy for farfield calculations during antenna simulation. Numerous new examples have been added for use as training tools or simulation templates including, “Wafer Etching with Plasma”- an example specifically requested
by Tech-X’s semiconductor clients.
As the latest release of Tech-X’s flagship product, VSim 11.0 has features that will benefit all users with computationally intensive simulation needs. More information can be found on the company website, and users interested in trying VSim 11.0 can request a free evaluation.
About Tech-X Corporation:
Tech-X creates high-fidelity simulation software that incorporates the latest research in computational physics and software development. Because of Tech-X’s parallel processing capabilities, their software simulations can run on laptops as well as the most powerful supercomputers. With applications from plasma discharge calculations to 5G, Tech-X’s software is used by engineers around the world to solve complex design problems.