Royce Instruments, LLC

480 Technology Way
Napa,  CA  94558

United States
http://www.royceinstruments.com
  • Booth: 1957

Please join us in booth 1957 to see a virtual demonstration of V-TEK, Inc.'s latest Royce Instruments automatic die sorter, the AP+.  Specializing in low to medium volume applications requiring frequent process changeover, the AP+ has options available for no surface contact pick-up, bumped die, MEMS devices, thin/fragile die handling, etc.  Our engineers are glad to discuss with you the latest bond test and die sorting challenges and solutions.

Categories

200 Packaging and Assembly Equipment
  • Die Removal Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
    • 203 Inspection & Measurement Products
  • Defect; Particle; Contam. Detection/Review/Inspect.
  • Die Inspection; Die Shear
  • Instruments; Bench Top Test
  • Wire Bonding Inspection; Test
    • 208 Test Equipment
  • Failure Analysis Systems
  • Package Test Systems
    • 700 Manufacturing Services
  • Calibration & Reference Standards

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