The USPTO along with the Patent Offices for China, Korea, EU, and Taiwan, have granted C&D Semiconductor with officially recognized patents for their proprietary technology found in the Backside Edge Bead Removal for their featured Synchrospin Coating Module.
C&D has integrated a disengaging baseplate onto their design for the Synchrospin Coating System, which allows exposure of a Backside EBR nozzle for efficient backside cleaning during the coating process. The disengaging baseplate allows the module to act as a standard coater when the co-rotating bowl and lid are not required.
C&D is proud to introduce the SynchroSpin® Coating System as one of the customizable modules for our P9000 family of products designed for coating planarization, with a Patented design for BEBR functionality.
The coat bowl, spin chuck, and the coat bowl lid all spin in synchronization. This co-rotation closed-lid coater results in near zero air turbulence inside the coat bowl, which improves coating planarization and greatly reduces chemical consumption.
The SynchroSpin® Coating System is C&D’s state-of-the-art coating system variant that features the simultaneous rotation of both top and bottom of the closed-lid coat bowl for a more controlled environment in which the photoresist is spread across the substrate during the spin coating processes.
The specially designed coater insert is also equipped with a patented integrated backside automatic wash function. Our patented BEBR and disengaging capability features programmable recipe steps which can disengage the co-rotating base plate from spinning together with the spin chuck, allowing access to the backside of the wafer for cleaning and other processing steps.
Used as a standalone coater, or together with other standard coater modules, your next P9000 tool will keep up with exacting requirements in today’s semiconductor industry.