The YES VertaBond is a production-proven automated vacuum anneal system equipped with uniform temperature control and laminar gas flow. This flexible system has an EFEM integrated with two process modules that can accommodate 200mm and 300mm wafers, or panel sizes ranging from 400mm to 550mm. The VertaBond wafer systems can process batch sizes of 50 wafers (one PM) or 100 wafers (two PMs). VertaBond panel systems can process batches of 12 panels (one PM) or 24 panels (two PMs).
VertaBond's vacuum technology delivers void-free bonding in less time and at lower temperatures, and Cu-Cu bonding without voids, delamination, or dishing. Laminar gas flow dramatically reduces particle contamination.
Common applications for the VertaBond system include 3D packaging, CMOS image sensors under panel, polyimide bake, copper anneal, wafer-to-wafer bonding anneal, DtP bonding, and PtP bonding.