Forge Nano

12300 N Grant St
Thornton,  CO  80241

United States
http://www.forgenano.com
  • Booth: 1165

Forge Nano is a global leader in surface engineering and precision nano-coating technology, using Atomic Layer Deposition. Forge Nano’s proprietary technology and manufacturing processes make atom thick coatings fast, affordable, and commercially viable for a wide range of materials, applications, and industries. Forge Nano’s suite of ALD and PALD products and services cover the full spectrum from lab-scale tools to commercial-scale manufacturing systems. Forge Nano technology significantly improves materials performance in lithium battery, catalysis, additive manufacturing, pharmaceuticals, and compound semiconductor markets.

 Products

  • Apollo
    https://forgenano.com/products/apollo/...

    • The Apollo system product line sets new benchmarks in productivity and cost effectiveness. Designed for high volume wafer-based production, our Semi-S2 certified Apollo systems integrate the high productivity of SMFD-ALD with a revolutionary simple substrate handling. The result is a flexible, modular system that can be easily configured to our customers needs.

    Apollo, Forge Nano's ALD tool for commercial scale semiconductor wafer coating

    PERFORMANCE

    APOLLO provides fully automatic cassette-to-cassette ALD processes with high throughput performance at the lowest cost of ownership. APOLLO leads in every aspect of ALD productivity, performance, cost, and sets a new standard for efficiency while reducing environmental impact. With its ‘zero-waste’ processing, APOLLO lowers factory power consumption and occupies a smaller footprint on the clean-room floor.

    DOWNLOAD BROCHURE

    CAPABILITIES

    • Thick film deposition ( >5 micron)
    • Short ALD cycle times (0.4-1 sec)
    • Low temperature processing (down to 80 °C)
    • 100% conformal films over any substrate topology
    • Seamless incorporation of nano-laminates with reproducible atomic-layer control
    • Composite ternary and quaternary alloy films with no throughput penalty

    SPECIFICATIONS

    Temperature Window: 50 – 500 °C

    Liquid Chemical Inlets: Up to 8

    Gaseous Chemical Inlets: Up to 4

    Footprint: 66″ L x 46″ W x 80″ H

    Capacity: Up to 200mm wafers

    Substrate Handling: Automated dual cassette

    BEST IN CLASS, MAINTENANCE AND SERVICE

    Chemistries: Al2O3, SiO2, AZO, TiO2, GaN, TiN, Bi2O3, Pt, Co, Cu, Ta205, Hf203, MLD

    Cost-effective, high-productivity ALD of many films and combination films including HfO2, ZrO2, Ta2O5, Al2O3, ZnO, ZnAlO, SiO2, HfSiO, TiO2, <300°  TiN, BN, GaN, Nb3N5 and more.

    Applications: Copper Barrier, ALD-Cap, Optical, Adhesion/Seeding, TCOs

    Design: APOLLO uses our millisecond response ALD manifold that integrates 10 of our patented Fast Pneumatic Valves (FPV) to deliver over 100 million trouble-free cycles of composite and nanolaminate ALD films. This manifold is the only ALD manifold that can switch composition every cycle without any throughput penalty. Field proven since 2005, our valves set  records for speed, reliability, lifetime and safety, while performing at temperatures as high as 220°C.  Forge Nano’s ALD valves are the only doubly contained, spill-free UHP valves on the market.  

    Add Ons: Ozone Generator, QCM, Plasma

  • Theia
    https://forgenano.com/products/theia/...

    • THEIA  combines production proven design and system components of our commercial solution APOLLO, in an R&D package that delivers                  unmatched performance, flexibility, reliability, and safety. THEIA is field upgradeable to accommodate the ever-changing needs of scientists and engineers. THEIA enables a seamless transition from   R&D to production. Recipes created with THEIA can be sent to APOLLO for a simple and straightforward path to commercial scale production.  
    Theia, Forge Nano's ALD tool for R&D scale semiconductor wafer coating

    PERFORMANCE

    THEIA delivers ultra fast deposition with Forge Nano’s patented SMFD-ALD™, in a low cost system for R&D budgets. Sub-second ALD cycle times allow efficient and rapid exploration of applications requiring thick films. Covering challenging patterned substrates such as advanced-generation DRAM device wafers, membranes, sensors, electron multipliers, etc. with aspect ratios up to 1,000. 
    THEIA is a low-cost versatile ALD system that fits most R&D budgets. The flexible chamber design allows for both; round up to 200 mm substrate chuck that fits semiconductor wafers, or square parts carrying tray that better accommodates panels or randomly shaped parts.
    DOWNLOAD BROCHURE

    CAPABILITIES

    • Fast and thick film deposition ( > 5 micron)
    • Fast ALD deposition at low temperatures
    • Low temperature processing (down to 80 °C)
    • Seamless incorporation of nano-laminates with reproducible atomic-layer control
    • Composite ternary and quaternary alloy films with no throughput penalty
    • In situ QCM monitoring of film growth with high mass and time resolution
    • Field reconfigurable

    SPECIFICATIONS

    Temperature Window: 50 – 500 °C

    Liquid Chemical Inlets: Up to 6

    Gaseous Chemical Inlets: Up to 4

    Footprint: 60″ L x 32″ W x 76″ H

    Capacity: Up to 200mm wafers

    5mm height clearance for coupons and objects

    Substrate Handling: Manual single wafer loading

    ULTRA FAST DEPOSITION WITH FORGE NANO’S PATENTED SMFD-ALD™

    Chemistries: Al2O3, SiO2, AZO, TiO2, GaN, TiN, Bi2O3, Pt, Co, Cu, Ta205, Hf203, MLD

    THEIA is ideal for exploration of newly developed ALD precursors. At the initial stage, ALD precursors are often extremely expensive ($1,000/gm is not unusual) and are    available in very small quantities. Users also  benefit from the many mature high productivity ALD processes that include HfO2, ZrO2, Ta2O5 SiO2, <300°C TiN, BN, GaN, Nb3N5 and more, available as turn-key processes from Forge Nano. Covering challenging patterned substrates such as advanced-generation DRAM device wafers, membranes, sensors, electron multipliers, etc. with up to 1,000 X enhanced area.

    Applications: Copper Barrier, ALD-Cap, Optical, Adhesion/Seeding, TCOs

    Design: THEIA is the only R&D tool for ALD that delivers blazing fast deposition compatible with large-scale production. With Forge Nano’s patented SMFD-ALD™, new powerful capabilities are finally available in a low cost system that fits most R&D budgets. Sub-second ALD cycle times allow efficient and rapid exploration of applications requiring thick films. Proprietary sources and processes enable new applications with unprecedented reproducibility and control. Film growth is monitored with better than 5% of monolayer resolution with an integrated QCM for finer process exploration and optimization and the finest growth details. THEIA allows you to unleash the full potential of atomic layer deposition.  

     Add Ons: Ozone Generator, QCM, Plasma

Categories

207 Process Equipment
  • Deposition; (CVD, PVD, ALD, Plating)

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