Provides high-efficiency protection for 300mm wafers during transportation and storage. The excellent air tightness and purge function can maintain the inside of the FOUP in a clean, low-humidity environment. Low outgassing and low moisture absorption materials can effectively reduce the risk of wafers being contaminated due to outgassing. All dimensions are in compliance with SEMI specifications, and can be customized according to machine parameter settings to ensure compatibility between the FOUP and machine.
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Size
300mm (12 in.)
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Material
PC or COP
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Piece
13 Piece,25 Piece
Feature
- 1.Low outgassing material: reduce outgassig to pollute the wafer
2.ESD static dissipative material: preventing the wafer from being damaged by static electricity.
3.Wear-resistant material: reduce particle generation
4.Excellent inflation performance and air tightness
5.Support OHT
6.Support RFID funtion
7.Support purge funtion
8.Selectable items：
a.Purge hole and quantity: customized design
b.Window: with window / without window