Heidelberg Instruments, Inc.

Product Highlights MLA 300 Maskless Aligner

Direct-write Lithography

No mask-related costs, effort, or security risks.

Flexibility

Direct writing in industrial production allows per-die pattern corrections, e.g. to react to distortions or process variations and serialization.

Time-saving

Shorter time from prototyping to production. Digital design management replaces conventional mask library.

Exposure Quality

Optical compensation of scaling, rotation; patented substrate tracking technology.

Dynamic Autofocus

Superior critical dimensions (CD) uniformity on warped or corrugated substrates.

Exposure Speed

300 x 300 mm in 19 minutes.

Full Facility Integration

Customizable automatic loader, substrate chuck including warped substrates, custom workflow “wizards” and interface with manufacturing execution systems (MES).

Low Cost of Ownership

Laser lifetime 10 years at 24/7 operation. Power consumption Eur 11,667 per year at 0.2 Eur/ kWh. Filters and replacement parts 5,400 Euro/year.

Product Highlights MLA 150

Perfect for Multiuser Facilities

Training <1 h to fully qualify as a user.

Fast and Accurate Alignment

250 nm front alignment, backside alignment, alignment error compensation.

Flexible

2 lasers can be installed simultaneously on the same system to expose the whole range of photoresists.

Low Operation Costs and Easy Maintenance

10-20 years of laser lifetime.

Direct-write Lithography

No mask-related costs, effort, or security risks.

Grayscale Mode

For simple 2.5D structures.

Exposure Quality

Edge roughness 60 nm; CD uniformity 100 nm; 40 nm address grid; autofocus compensation for warped/corrugated substrates.

User-friendly

Specifically designed software and workflow make the tool operation fast and easy.

Exposure Speed

150 mm wafer in <16 min with 405 nm laser.

Product Highlights ULTRA

High Exposure Quality

Line edge roughness 20 nm; CD uniformity 30 nm; positioning accuracy 40 nm; real-time optical autofocus; custom high numerical aperture (NA) write-lens optimized for laser exposure.

High Precision

XY stage fully designed and manufactured by Heidelberg Instruments; full air bearing stage; zero thermal expansion zerodur™ chuck; differential interferometer for position measurement.

Precise Second Layer Alignment

Sophisticated correction matrix based on a 2D measurement of the first layer. Compensation of arbitrary local position distortions; 100 nm accuracy.

High Throughput

High-speed SLM with high data rate for fast exposure. 6″ mask in < 45 minutes.

Writing Stability

Closed-loop environmental chamber complies with stringent requirements for semiconductor photomask production; integrated metrology system with flowbox and software corrections compensates for any variations in environmental parameters.