World leader in wire bonding technology for microelectronics, Hesse Mechatronics designs and manufactures all types of wire bonders and smart welders. This includes ball, fine and heavy wedge, fine and heavy ribbon bonders as well as smart welders from 100W up to 1.5kW systems. We also provide automation solutions. Hesse Customer Solutions provides design and production services for both wire bonding and smart welding applications.
Wire Bonding Equipment
Hesse Mechatronics high-speed, fully automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 15 microns (.0006") to 500 microns (.020") diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon).
Wire Bonding Services
Hesse Customer Solutions supports early-stage product development and wire bonding/smart welding process support, development and production of prototypes and pre-production manufacturing in strategically located applications and demonstration labs throughout North America.
Wire Bonding Videos
Register to view our wire bond videos at www.wirebonddemo.com