LPKF develops systems for tasks in microelectronics.
An entirely new market into which LPKF will be penetrating this year is the semi-conductor market. As the first link in the electronics production chain, chip manufacturers are setting the pace and pressing ahead with miniaturization. It is becoming increasingly common for electronic components on circuit boards to be arranged one on top of the other rather than next to one another. Multi-chip modules are placing new demands on chip package assemblies and on the materials used.
With the Vitrion 5000, LPKF has introduced a system that can drill ultrafine holes in very thin glass (Through Glass Via). The TGV technology is particularly suitable for economically producing the redistribution layers (interposer) of the multi-chip modules at a very high quality. Consequently, chip manufacturers could switch over from silicon or organic materials to glass. They would thus reduce material costs and improve the performance of multi-chip modules.