Malico's revolutionary breakthrough in developing process which successfully form Tungsten-Copper material in net shape. Tungsten copper (W-Cu) composite provides the most integral value as a heat spreader or thermal lid for modern high-end IC packages and modules, for its properly low CTE, better-than-copper strength, and high thermal conductivity. A cost-effective cooling mechanism is a necessity to the commercial success of high-end IC packages and high-speed-transmitting modules. Tungsten copper heat spreader is definitely one of the most critical elements for implementing structural integrity and thermal reliability of highly integrated and slim IC packages for different industries .