3D-Micromac AG

microVEGA™ xMR for selective laser programming of magnetic sensors is an industrial production-approved technology with many advantages. By enabling a one-step process, this solution significantly reduces the costs for sensor chip manufacturing. Selective laser pinning on microVEGA™ xMR is by far the most efficient technology in terms of cost, throughput, yield and quality (sensitivity) to accurately program magnet sensor devices. The microVEGA™ xMR is fully automated and can be programmed for different sensor and wafer designs by recipe. The conversion from GMR to TMR is done only by selecting the correct recipe. All important tool data during programming can be organized by product type, saved in log files and ― if required ― transmitted via standard data interfaces.

The formation of ohmic contacts on the backside of SiC power devices plays a key role in defining the electrical characteristics and mechanical strength of the device.

Traditionally, thermal annealing processes using flash lamps with millisecond pulses have been used for OCF on the backside of SiC wafers. Because this process requires temperatures of upwards of 1000° C, which can be detrimental to structures on the front side of the wafers, flash lamps are limited to wafer thicknesses of 350 microns and above.

As the industry now migrates to thinner SiC power devices for improved electrical performance and thermal management, new annealing solutions are needed that minimize these thermal effects. Laser annealing using UV nanosecond pulses provides the high precision and repeatability needed for OCF on the backside of SiC wafers, while ensuring no thermal damage to the wafer frontside that can negatively affect device performance.

The microPRO™ XS OCF system provides selective laser annealing with high repeatability and throughput in a versatile system. Combining a state-of-the-art laser optic module with
3D-Micromac’s modular processing platform, the microPRO™ XS is ideally suited for ohmic contact formation (OCF) in silicon carbide (SiC) power devices. It forms ohmic interfaces a while preventing the generation of large carbon clusters and heat-related damage to the front-side of the wafer.

microPREP™ PRO is 3D-Micromac‘s laser-based sample preparation system, that provides smart sample preparation processes for a variety of specimen preparation applications.

With its integrated ultrashort pulsed laser source, it complements existing approaches to sample preparation such as ion beam processing, x-CT, and microscopic analysis of any kind.

microPREP™ PRO is suited to ablate metals, semiconductors, ceramics, polymers, and compound materials. It creates new vistas for material and process development as well as failure analysis.

At sufficient power, laser radiation is able to ablate all kinds of materials. Furthermore, lasers can be positioned very precisely on a given workpiece and straightforwardly focused using standard optical elements. By using ultra-short pulse lengths in the picosecond range, superficial surface heat influence from ablation is narrowed to depths of a few microns or less.

With sophisticated workflows microPREP™ PRO meets the specific requirements of several analytical techniques. Therefore, microPREP™ is perfectly suited to complement TEM, SEM/FIB cross sectional analysis, atom probe, X-ray tomography and micromechanical testing processes. In addition, numerous patents ensure competitive advantages for users compared to existing approaches in the field of sample preparation.

microPREP™ PRO reduces time-to-sample significantly. Moreover, microPREP™ PRO gurantees a higher utilization of other tools within the analysis chain while keeping the costs of ownership low.