PI (Physik Instrumente)

 Driven with voice coil linear motors and piezo motors and flexure guides for ultra-precision guiding precision, travel ranges of 7mm and 800 microns are achievable, respectively.

The new P-725 high speed nano-focus stage integrates wear-free, lever-amplified piezo drives for 24/7 operations without particle generation. The P-725 mechanical design provides with high stiffness for high dynamics and short settling times and for high payload of larger objectives.  Up to 800μm travel to match wafer thickness and subnanometer resolution. 

The V-308 voice-coil nanofocus slide system provides 7mm of highly dynamic travel with nanometer resolution. It is guided by high-precision crossed roller bearings. The centrally mounted linear voice-coil motor was developed by PI for high dynamics, fast settling, and high resolution. Acceleration to 0.8g and velocity to 8”/sec are feasible, and extremely short step-and-settle times <15msec (step size to 1/4µm) within an error band of only ±15 nanometers. PI’s proprietary PIOne, picometer resolution interferometric optical incremental encoder is integrated 

The new 5-Axis air bearing stage features a planar XY air bearing stage and very compact Z-Tip-Tilt Stage providing the following advantages: Defect and edge placement error (EPE) inspections, Highly adaptive surface, inspection, High throughput, Reduced dynamic errors and optimized focusing time, High reliability at high duty cycles, Reduced cost of ownership, Secured yield

Applications of the 5-axis air bearing stage include:

• Indexing, positioning,
• Wafer/substrate test and inspection
• Scanning, metrology
• ACS based alignment solutions for production test and packaging needs
• Direct-write lithography
• µLED fabrication
• Clean room applications

The multi-axis nanopositioning system is based on an A-311 planar XY-air bearing stage with long travel range up to 300mm and a special low-profile 3-axis Z-Tip-Tilt stage.   The multi-axis positioning stage is operated by an idustrial 6-axis high precision motion controller.  

A new multi-axis stage and advanced motion controller with hardware and software for precision laser control allows better separation of individual dies from the wafer. In this process, quality and precision are crucial for all further post-fab operations. Laser dicing has therefore become the preferred dicing technology. One variant of laser dicing is the so-called stealth laser dicing (SLD). This involves creating a modified layer within the wafer by focusing a laser below the surface, and then using a tape expander to separate the chips.

The A-523 Wafer Alignment and Positioning stage is a parallel kinematics, space saving design and provides Theta-X/ Theta-Y and Z Axis motion with very high precision for wafer adjustment and offset corrections in 3-DOF. Direct drive linear motors with air bearings for high-precision levelling, frictionless design with minimal hysteresis provides high repeatability and adjustments in the nanometer range, low-profile design for easy integration, maintenance-free with long lifetime in 24/7 operations. The A-311 XY Axis Planar Air Bearing Stage provides high-Dynamic Wafer Scanning Motion.  Air-bearing planar scanners with ironless linear motors guarantee high, cog-free scanning speed and fast stepping and settling times.  An Advanced Automation Controller with EtherCAt interface, synchronizes Laser control.