Sikama International, Inc.

Sikama’s EA UP1200 Oven is the next generation of safe, fluxless reflow solder solutions for wafer bumping applications. Using innovative Electron Attachment technology, developed in partnership with Air Products™, the EA UP1200 provides unmatched performance offering truly residue-free fluxless soldering.

The system is operated with N2 cover gas and an H2/N2 blend with less than 5% hydrogen, ensuring safe operation.

To provide customizable profiling, the oven contains eight working zones, six heating and two cooling.  Also included are external load and unload zones which can operate in local mode or can be integrated into a flowing process using SMEMA or SECS/GEM connectivity to other process machinery.  The heating and cooling zones utilize the Sikama contact thermal transfer for the bottom elements and combined convection and radiant thermal transfer for the top elements.  Each cooling and heating zone is independently temperature controlled permitting a complex thermal profile to be used in the fluxless reflow process.

Our patented design for balanced heating and cooling means low cost operations on production runs of substrates up to 5″ by 5.75″, and the 5C’s 400° C maximum heat will handle fluxless gold tin reflow, singulated ball reflow of BGA’s, fixtured double-sided boards, large microwave components, and various substrate materials. With conductive heating from below, convection heating from above, precise temperature control and atmospheric purity, you receive total control of your Benchtop Reflow Oven.

More value, less space

Providing exceptional value per square foot of floor space, the Falcon 5C offers the capabilities of a full size reflow oven in a compact bench top design.

More capability, less money and floor space

The Falcon 5C can process large microwave components, double-sided boards, BGA’s, fluxless gold tin, and much more, all at a fraction of the cost and size of a full-size oven.

More versatility, less space

The 5C provides left to right or right to left process flow, as well as 4 heating zones and 2 cooling zones to deliver the utmost in versatility, all while using less than 10 square feet of floor space.

More capability, less space

Sikama’s 5C benchtop reflow oven provides an optional batch process software option, which allows individual dwell times per heating and cooling zone. This allows maximum single-part flexibility while utilizing under 10 square feet (1 square meter) of space.

The Sikama UP1200 Oven has eight (8) work zones internal to the oven: six (6) heat zones and two (2) cooling zones. In addition, there is a load zone and an unload zone. The heat and cool zones have both top and bottom heating/cooling elements. The heating and cooling zones utilize the Sikama contact thermal transfer for the bottom elements and combined convection and radiant thermal transfer for the top elements. The load/unload zones can operate in local mode or can be integrated into a flowing process using SMEMA connectivity to other process machinery. The system may be operated with cover gases such as nitrogen or forming gas. Each cooling and heating zone has independent temperature controls, permitting a complex thermal profile to be used in the reflow or curing process.

The Sikama UP1200 can be operated “stand alone” using the operator control panel on the front of the machine or it can be controlled using the Sikama Integrated Control Software running on a MS Windows PC computer. The computer is connected to the UP1200 via a RS232 interface cable.

The UP1200 utilizes either a walking beam transport system or the LIFT system which accommodates warped wafers and heavier components. Both transport systems move the work item from zone-to-zone through the oven without friction or vibration. Each system lifts the work above the bottom contact heating zones and carries the work item to the next zone. The work item is not dragged or pushed, reducing the possibility of damage due to scraping or scratching.