Applied Microengineering Ltd.
AML unique in-situ Aligned Wafer Bonding Machines & Services
AML, established in 1992, designs and manufactures Wafer Bonding systems with integrated in-situ alignment capabilities.
The AWB systems enable a wide range of bonding techniques to be carried out and are ideally-suited to process development. With a worldwide customer base, AWB systems are used for both R&D and commercial production of devices for wafer sizes up to 8”.
The systems feature an integral, optical wafer-to-wafer alignment system as standard, with the capability of 1µm accuracy. All bonding process steps can be carried out sequentially within the bonding chamber, so without exposure to air between stages:
- Wafers are held in separation, up to 30mm apart
- operation under vacuum or controlled atmosphere
- independent heating of upper/lower wafers, up to 560°C
- in-situ radical-activation or chemical treatment of bonding surfaces
- in-situ alignment, immediately prior to bonding
- bonding, with contact forces up to 40kN
The systems offer auto-aligning and bonding via user-programmed recipes.
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