Trion Technology

2131 Sunnydale Boulevard
Clearwater,  FL  33765

United States
https://triontech.com
  • Booth: 745


Plasma Etch, Strip, and Deposition Systems

For over 30 years, Trion Technology Inc (a USA company) designs, manufactures, markets and services versatile plasma equipment (ICP-RIE, PECVD, PVD, Ashers, and more) to enable our customers in the Semiconductor, MEMS, LED, RF Power, F.A., Opto-, III-V, Wafer Level Packaging, Thin Film Head, and Solar industries.

GaN Etch, GaAs Etch, SiO2 Etch, Si02 Deposition, Si3N4 Etch, Si3N4 Deposition, and more.

Our products feature the smallest footprint and lowest cost systems in the industry with proven production reliability. If you wish anything from full-blown production cluster tools to a simple laboratory system, Trion makes it.

Click: https://triontech.com/
Email: info@triontech.com
Phone: +1 727 461 1888

 Products

  • Apollo Photoresist Stripper
    Plasma Asher / Reaction By-Products of Plasma Etching / Photoresist Stripping MEMS, Compound Semiconductor, Pilot Line Production, Inductively Coupled Plasma, Industrial Machinery, Stripping Systems, Ashers, Integrated Circuits, Fabricating Wafers...

    • The cost of new photoresist stripping systems has escalated to unreasonable levels. Trion has solved this critical problem. The Apollo Stripper is a compact, inexpensive, and versatile system which can be configured for a 200mm or 300mm Chuck. By employing RF bias power, difficult to remove layers of resist can be removed at low temperatures. As required by application, this system can incorporate a microwave source (which is both reliable and free from typical microwave tuning problems) or ICP technology.​

    For more information:
    Click https://triontech.com/plasma-ashing/apollo/
    Email info@triontech.com
    Call +1 727 461 1888
    https://triontech.com

  • Phantom Reactive Ion Etcher
    MEMS, Solid State Lighting, Failure Analysis, Research & Development, Pilot Line, Fluorine Etch Processes, SF6, CF4, CHF3, O2, Inductively Coupled Plasma, SiO2 Etch, Si3N4 Etch, ICP-RIE, Wafer Level Packaging, Integrated Circuits, Fabricating Wafers...

    • The Phantom RIE is designed to supply research and failure analysis laboratories with state-of-the-art plasma etch capability using single wafers, dies or parts using fluorine and oxygen based chemistries. The system has a compact, modular design built on a space-saving platform.

    For more information:
    Click https://triontech.com/etch-platform/phantom-rie/
    Email info@triontech.com
    Call +1 727 461 1888
    https://triontech.com

  • Oracle RIE/ICP/PECVD Production Cluster Tool
    ETCH: Reactive Ion Etch, Inductively Coupled Plasma, RIE-ICP, ICP-RIE, Fluorine Etch, Corrosive Chemistry Etch, GaN Etch, GaAs Etch, SiO2 Etch, Si3N4 Etch. DEPOSITION: PECVD, PVD, Chemical Vapor Deposition, CVD, SiO2 Dep, Si3N4 Dep....

    • The Oracle is the smallest and most flexible full production cluster system on the market. The system consists of a Central Vacuum Transport (CVT), Vacuum Cassette Elevators and up to four Process Reactors. These process reactors are docked to the central loadlock and run in production-mode or can be operated independently. The Oracle can also be configured for either the laboratory environment (with single wafer loading) or for full production (with vacuum cassette elevators).

    Because the Oracle accommodates up to four separate process chambers, there are many possible process combinations, including ash, etch, and deposition modules. Processes are safely run without atmospheric contamination since all chambers are vacuum loadlocked.

    Applications:     Compound Semiconductor, Photonics, Research & Development, Failure Analysis, Pilot Line, Production

    Markets: Optoelectronics, III-V, Wafer Level Packaging, Integrated Circuits, Fabricating Wafers

    For more information:
    Click     https://triontech.com/etch-platform/oracle-cluster/
    Email info@triontech.com
    Call +1 727 461 1888
    https://triontech.com

Categories

204 MEMS Equipment
  • Deep RIE etching; Dry Etching
  • Wafer Level Bonders
    • 205 Nanotechnology Equipment and Tools
  • Equipment, Nanotechnology Tools
    • 207 Process Equipment
  • Deposition; (CVD, PVD, ALD, Plating)
  • Deposition; PVD; Sputtering; Evaporation Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment

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