Please join us in booth 1540 to see a virtual demonstration of V-TEK, Inc.'s latest Royce Instruments automatic die sorter, the AP+. Specializing in low to medium volume applications requiring frequent process changeover, the AP+ has options available for no surface contact pick-up, bumped die, MEMS devices, thin/fragile die handling, etc. Our engineers are glad to discuss with you the latest bond test and die sorting challenges and solutions.