Develop the chips of the future with SET flip-chip bonders.
Founded in 1975, SET - Smart Equipment Technology - based in Saint-Jeoire, France, is a world leading supplier of high accuracy flip-chip bonders -die-to-die and die-to-wafer.
With device bonders installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its equipment.
The SET flip-chip bonders adapt to all main bonding techniques: fluxless reflow, adhesive joining compression and thermosonic.
SET has representatives in North America and offers a comprehensive product portfolio of flip-chip bonders for fast growing markets and serving clients through a global network of representatives and in-depth customer trainings.