SICONNEX, WET BATCHSPRAY EXPERT
Siconnex provides surface preparation equipment and processes, including WET BATCHSPRAY (Etch, Clean, Resist Strip) systems for the III-V semiconductor, MEMS, wireless, power, energy harvesting, WLP, data storage, logic and other industries.
The Siconnex BATCHSPRAY® technology helps to make innovations such as smartphones, solar panels and power electronics more affordable and accessible to consumers and businesses around the world.
Siconnex systems are leading when an extremely small footprint, safety, full automation, high throughput and economical resource consumption is important.
Spray System Advantages:
- Automated Dry in - Dry out process
- Up to 5 different processes/chemicals in one sequence
- Smal footprint (~ 20 sqft.)
- Low DI Water consumption (up to 80% less compared to wet bench)
- Low Exhaust (encapsulated system)
- Operator safety (Operators can never get in contact with chemicals)
- Repeatable process control
- ROI typically under 1 year