TESCAN

TESCAN AMBER X FIB-SEM

• Low-kV high-resolution imaging with enhanced topographic contrast of target layers
• Imaging of edges of delayered or cleaved chips using field-free high-resolution technology
• Electrical characterization of the most sensitive semiconductor devices using in-situ nanoprobing
• Dedicated and proprietary gas chemistries for sub-14 nm nodes deprocessing
• End-pointing software module for semiautomated deprocessing enables stopping the process at a desired layer
• Easy-to-use, fully customizable, applicationoriented and modular user interface

TESCAN SOLARIS FIB-SEM

• Precise end-pointing at low electron beam energies
• Low-kV ultra-high-resolution imaging of high-end semiconductor devices
• Gentle FIB thinning for improved quality results in TEM sample preparation enabled by excellent low-kV ion beam performance
• Optimized workflows and recipes for easy preparation of ultra-thin TEM lamellae
• Semi-automated software module for site-specific TEM lamella preparation
• Preparation of advanced geometry TEM lamellae from the most advanced semiconductor nodes
• Specialized, load-lock-compatible stage carousel for TEM sample preparation
• Dedicated TEM grid holders with fully optimized geometry for advanced TEM sample preparation

TESCAN SOLARIS X FIB-SEM

• Curtaining-free large-area cross-sectioning for physical failure analysis of advanced packaging technologies
• Prepare large area FIB-cross-sections up to 1 mm wide
• Obtain low noise, high-resolution image at low keVs in short acquisition time at FIB-SEM coincidence with the sample tilted
• Live SEM-monitoring during FIB milling for precise end-pointing
• Observe the most beam-sensitive materials using low keVs ultra-high resolution for surface sensitivity and high material contrast
• Effective techniques and recipes for fast and artefact-free cross-sectioning of composite samples (OLED and TFT displays, MEMS devices, isolation dielectrics) at high currents
• Essence™ easy-to-use modular user interface