Atonarp

5960 Inglewood Drive, Suite 100
Pleasanton,  CA  94588

United States
http://www.atonarp.com/aston
  • Booth: SS9


UNLOCKING MOLECULAR INSIGHTS

Atonarp Aston is also at booth 1362 (Banner Engineering)

ASTON from Atonarp is a robust, compact mass spectrometer, designed from the ground up to be the workhorse metrology tool for gas monitoring and control for semiconductor manufacturing. Real-time performance combined with best in class sensitivity at speed and  production-ready robustness, support increased throughput and maximized yields.   Ideal for ALD, ALE, Etch, CVD, Abatement, EUV, Sub-FAB, chamber cleans. 


 Press Releases

  • Where to start with sustainability optimization in FABs given that not all greenhouse gases are the same

    https://assets.website-files.com/61de02ecf362d7bf4e363aa6/62b0a61d3c2442f711f5b83c_Atonarp_Not%20all%20greenhouse%20gases%20are%20the%20same_clh%20Fin.pdf

    The world’s largest semiconductor consumer, Apple, and similar silicon-hungry companies like Google and Microsoft, are driving suppliers to set ambitious carbon and greenhouse gas (GHG) emission goals. Sustainability compliance is becoming an important quality metric in quarterly scorecard reviews between suppliers. Not only is carbon and GHG emission reduction good for the planet, it’s increasingly critical for business success. Lucrative contracts are being won and lost partly on how companies are performing to their sustainability goals, and hundreds of millions of dollars are at stake.

    Where to start on Scope 1 emissions?  For many fab operators it’s a daunting problem. Process chemistry is highly diverse, and materials and by-products are extremely difficult to recapture for reuse or recovery. Most waste is going to wet-burn abatement systems for destruction, using GHG-generating natural gas. Destruction rate efficiency (DRE) is not 100% and the percentage that is not destroyed and is vented to the atmosphere. As can be seen in figure 1 and figure 2 below, the relative impact of all greenhouse gases is not equal. When GHG potency relative to CO2, years of atmospheric residency, and volume of gas used in semiconductor manufacturing are considered, the etch and clean gases namely NF3 (Nitrogen Trifluoride) and SF6 (Sulfur Hexafluoride) rise to the top of the list for attention. 

  • https://www.atonarp.com/atonarp-news/atonarps-aston-impact-metrology-platform-starts-volume-shipments-to-semiconductor-fabs-in-korea

    Atonarp, the leader in in-situ, real-time high-sensitivity metrology for semiconductor process control, announces worldwide release for sale of its Aston platform. This marks an important milestone in the Company’s transition to a commercial organization on a worldwide scale.

    Aston is a compact mass spectrometer that provides accurate, real-time data on the process chemistry with sensitivity to measure the molecular concentrations down-to parts per billion. This data enables semiconductor manufacturing FABs to run more efficiently, thus increasing the yield and throughput, delivering dramatic financial benefits to FAB operators.

    Atonarp is shipping production orders of Aston Impact to leading semiconductor FABs and equipment manufacturers in Korea and the USA. It is also shipping dozens of Aston units for clients’ evaluations in their advanced processes to optimize their process and manufacturing efficiencies.

    Aston provides actionable data for advanced semiconductor applications such as atomic level deposition (ALD) and sub-fab operations. At less than nine parts per billion square root of Hertz (9ppb√Hz),Aston offers up to ten times better sensitivity than competitors' solutions, without compromising on the speed at which data can be gathered.


 Products

  • > Aston Impact - Best in class in-situ metrology
    ASTON Impact is a robust, high speed with high-sensitivity mass spec. for harsh, corrosive gas environments. Optimized for ALD, ALE in-situ process control and chamber cleans, safety, sustainability and sub-fab management....

  • Semiconductor Process Control

    ASTON Impact and ASTON Plasma are robust, high speed with high-sensitivity mass spectrometers that can withstand the harsh, corrosive gas environments required for advanced semiconductor in-situ process control. They deliver actionable, quantitative data needed to optimize processes and improve yield.

    The offer best in class sensitivity at speed required for accurate and actionable end point detection for efficient semicondutor process control 

    Key Application Areas:

    • Atomic Layer Deposition (ALD) :
      Speed with sensitivity to optimize throughput and safety management. expecially for demanding spatial ALD applications
    • Etch / Atomic Level Etch (ALE) endpoint
      Sensitivity for dielectric and metal etch endpoint detection to 0.3% Open Area (OA).  Also processes with remote plasma sources
    • Chamber management (optimized chamber clean)
      Clean endpoints with corrosive gases and no plasma, safety management for high order silances, chamber matching and profiling.
    • Dry Clean with Remote Plasma
      Aston is ideal for remote plasma dry clean process management endpoints.
    • Sub FAB management
      Safety, Sustainability and Savings.  Abatement DRE managament.
  • > Aston Plasma - Best in class in-situ metrology
    ASTON Plasma is a robust, high speed with high-sensitivity mass spec. for harsh, corrosive gas environments. Optimized for ALD, ALE in-situ process control and chamber cleans, safety, sustainability and sub-fab management. ...

  • Semiconductor Process Control

    ASTON Impact and ASTON Plasma are robust, high speed with high-sensitivity mass spectrometers that can withstand the harsh, corrosive gas environments required for advanced semiconductor in-situ process control. They deliver actionable, quantitative data needed to optimize processes and improve yield.

    The offer best in class sensitivity at speed required for accurate and actionable end point detection for efficient semicondutor process control 

    Key Application Areas:

    • Atomic Layer Deposition (ALD) :
      Speed with sensitivity to optimize throughput and safety management. expecially for demanding spatial ALD applications
    • Etch / Atomic Level Etch (ALE) endpoint
      Sensitivity for dielectric and metal etch endpoint detection to 0.3% Open Area (OA).  Also processes with remote plasma sources
    • Chamber management (optimized chamber clean)
      Clean endpoints with corrosive gases and no plasma, safety management for high order silances, chamber matching and profiling.
    • Dry Clean with Remote Plasma
      Aston is ideal for remote plasma dry clean process management endpoints.
    • Sub FAB management
      Safety, Sustainability and Savings.  Abatement DRE managament.

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