Tignis Inc.

701 N 36th St
suite 340
Seattle,  WA  98103

United States
http://tignis.com
  • Booth: 744


AI Process Control Platform for Next-Generation Technology

Tignis specializes in AI-powered semiconductor manufacturing process control with a physics and engineering foundation. Tignis’ innovative software solutions use AI and machine learning to enable next-generation manufacturing processes. Tignis helps you increase manufacturing yield, decrease process downtime, and reduce costs. Actively working with the world’s top semiconductor equipment manufacturers, Tignis also has a proven track record of empowering other large-scale mission-critical industries. Tignis solutions are deployed in hundreds of facilities worldwide.


 Press Releases

  • Introductions for Tignis and M Ventures Accelerated through Global Semiconductor Industry Association SEMI Startups for Semiconductor Sustainability Program

    SEATTLE, Wash., July 7, 2022 – Tignis, a technology innovator in AI process control for semiconductor manufacturing, today announced it has received Series A funding from M Ventures, the strategic corporate venture arm of Merck, KGaA, Darmstadt, Germany—a leading science and technology company. This investment brings Tignis’ total Series A funding received in 2022 to $10 million. Tignis was introduced to M Ventures through the SEMI Startups for Semiconductor Sustainability program.

    Tignis will use the funds for sustainability-focused product development and semiconductor industry expansion. Tignis’ technologies are currently in use by multiple top-five global semiconductor equipment companies, with signed contracts in place to provide AI process control technology for next-generation semiconductor manufacturing tools. 

    “M Ventures possesses tremendous vision, semiconductor industry expertise and technological excellence, and we look forward to the value our relationship with them will bring,” said Jon Herlocker, president and CEO of Tignis. “Advanced process control for semiconductor manufacturing is key to getting new materials and processes qualified, and our funding from M Ventures will help advance Tignis in our continued innovation. Our PAICe physics-driven AI computational modeling and monitoring platform accelerates next-generation semiconductor manufacturing—from equipment R&D to reliable high-yield chip fabrication capability. The Year 1 SEMI Startups for Semiconductor Sustainability program was an excellent venue for connecting early-stage companies like Tignis with key industry players, and resulted in our relationship with M Ventures.”

    “We are focused on identifying and financing novel solutions to some of the most difficult challenges, with sustainability being an important pillar,” shared Owen Lozman, managing director of M Ventures. “We support ideas driven by great entrepreneurs, helping translate innovation towards commercial success. We are pleased to help support Tignis in their expansion of advanced process control technologies in semiconductor manufacturing. Industry leaders are looking toward AI and machine learning to achieve their goals for developing next-generation semiconductor technology while meeting sustainability targets. Tignis brings an impressive track record in delivering physics-driven AI computational modeling and monitoring for mission-critical processes.”

    “We’re pleased about this important outcome for Tignis and M Ventures,” shared James Amano, senior director, EHS and Sustainability at SEMI. “Our SEMI Startups for Semiconductor Sustainability program is focused on connecting the world’s top early-stage businesses to semiconductor industry leaders and making introductions to VCs looking for insights on future investment opportunities in sustainable technologies. We’re proud to have had a pivotal role in fostering the introduction between Tignis and the M Ventures team during our Year 1 event.”

    Tignis PAICe Product Suite 

    For semiconductor equipment manufacturers, Tignis’ PAICe Maker physics-driven AI computational modeling platform accelerates next-generation semiconductor manufacturing—from equipment R&D to reliable high-yield chip fabrication capability. Tignis allows machinery to have the power of AI and machine learning built-in, enabling the best control parameters to optimize each manufacturing run or batch.  

    For semiconductor fabricators, Tignis’ PAICe Monitor enables process engineers and equipment technicians to leverage Tignis’ Digital Twin Query language to transform in-product fault diagnosis into continuous real-time monitoring. Fabricators can diagnose increasingly complex problems and resolve nonstandard events in the production line, improve processes, and review technological health and stability. This results in improved productivity, higher yield in high volume production, faster cycle time, and cost savings. 

    About M Ventures

    M Ventures (m-ventures.com/us) is the strategic, corporate venture capital arm of Merck KGaA, Darmstadt, Germany. Its evergreen mandate is to invest in innovative technologies and products with the potential to significantly impact the core business areas of Merck KGaA, Darmstadt, Germany. From its headquarters in Amsterdam and offices in Germany, US and Israel, M Ventures invests globally in transformational ideas driven by great entrepreneurs. M Ventures takes an active role in its portfolio companies and teams up with entrepreneurs and co-investors to translate innovation towards commercial success. M Ventures focuses on identifying and financing novel solutions to some of the most difficult challenges.  

    About Tignis

    Tignis (tignis.com) specializes in AI-powered process control with a physics and engineering foundation. Headquartered in Seattle, the company develops and sells innovative software solutions that use AI and machine learning to enable next-generation manufacturing processes—increasing manufacturing yield, decreasing process downtime, and reducing costs. Actively working with the world’s top semiconductor equipment manufacturers, Tignis also has a proven track record of empowering other large-scale mission-critical industries. Tignis solutions are deployed in hundreds of facilities worldwide.

  • Tignis, a Technology Innovator in AI Process Control Solutions for Semiconductor Manufacturing, Announces $7.2 Million in Series A Funding to Expand Sales Team, Take Company to the Next Level of Growth

    Seattle (May 12th, 2022) – Tignis, a technology innovator in AI process control for semiconductor manufacturing, today announced the completion of $7.2 million in Series A Funding led by early-stage venture capital fund DN Capital with participation by Silicon Valley venture capital firm Clear Ventures, former Microsoft Executive/VMware CEO Paul Maritz and former GE Digital CTO Harel Kodesh. 

    Tignis, the only company hyper-focused on AI process control for semiconductor manufacturing, will use the funds to expand its sales team and execute on current contracts. Tignis’ AI process control technology is both deployed directly on semiconductor fabrication equipment from OEMs and layered on top of existing manufacturing processes. Launched in 2021, Tignis’ PAICe Product Suite accelerates the ability to build, validate and deploy physics-driven, machine learning-enabled solutions in semiconductor manufacturing. PAICe Monitor allows process engineers to quickly harness data using Tignis’ proprietary low-code language to find and investigate problems with production, while PAICe Maker dramatically speeds up simulations, enabling semiconductor manufacturers to adaptively control complex OEM machinery in real time. 

    Tignis’ technologies are in use by multiple top-five global semiconductor equipment companies, with signed contracts in place to provide AI process control technology for next generation semiconductor manufacturing tools. According to the company, today’s announcement represents an important step in realizing its vision of advancing the semiconductor manufacturing industry through AI process control.

    “This funding will accelerate Tignis on its journey of advancing physics-driven AI process control as an enabler of the next generation of semiconductor manufacturing,” said Jon Herlocker, president and CEO of Tignis. “AI Process control will accelerate semiconductor process development, improve efficiency and quality, and enable manufacturing technologies that previously were too complex to model, resulting in production of smaller and more complex chips, faster time to market and improved yield while reducing the cost of operations. In addition, the advancement of AI process control technology in semiconductor manufacturing that Tignis is undertaking is of particular importance to the US market, to re-establish competitiveness and leadership in this industry.”

    Jon and Matt have built a world-class team which is pushing the limits of innovation in the most technologically savvy sectors in the world,” said Steve Schlenker of DN Capital. “Tignis is an enabling technology which democratizes machine learning for process engineers and optimizes process control for semiconductor companies – this is one of the most valuable use-cases for applying AI in industrial process manufacturing. We are extremely excited to lead this investment round in Tignis.”

    “It has been my privilege to represent Clear Ventures as an early-stage IT VC on the Tignis Board of Directors, and I have been impressed with the Tignis team’s extreme clarity of purpose and excellent execution,” said Chris Rust, Founder and General Partner at Clear Ventures. “Given their deployments at some of the world’s most valuable manufacturing companies, it is now clear that Tignis has delivered what comes next in AI-based industrial process control (AIPC). The Tignis software suite makes it easier than ever before to build ‘digital twins’ of complex, mission-critical real-world systems in a no-code way. Their AIPC platform then ingests all available sensor and telemetry data, does cutting-edge ML-based analytics, and provides real-time, closed-loop process tuning to maximize business performance. This new financing provides timely resources to meet robust customer demand.”

    In addition to today’s funding announcement, Tignis has raised $7.4 million in angel and seed funding since 2017, not including a $1 million dollar investment in 2021 from innovation company BMNT. Tignis also completed the enterprise accelerator program H4XLabs to accelerate the growth of its first commercial product.

    About DN Capital

    DN Capital (dncapital.com) is a leading European early-stage venture capital firm with operations in London, Berlin, and Silicon Valley. The firm focuses on Seed, Series A, and select Series B investments in software, fintech, marketplace, and consumer internet. DN Capital’s mission is to support entrepreneurs in creating global category leaders. DN was an early backer in companies such as Shazam, Endeca, Auto1, GoStudent, Jobandtalent, Mister Spex, HomeToGo, OLX, Remitly and Incode.

    About Clear Ventures

    With $330 million of capital from a world-class investor base, Clear Ventures (clear.ventures) is a Silicon Valley venture capital firm that is purpose-built to help startup teams win in frontier technology and services. Founded by veteran company builders and venture investors Chris Rust and Rajeev Madhavan, formerly of Sequoia Capital and USVP and founders of five successful companies, Clear provides early capital, connections, and company-building insights to bold startup teams so their ideas can grow into market-leading companies. 

    Tignis (tignis.com), Headquartered in Seattle, specializes in AI-powered process control with a physics and engineering foundation. The company sells innovative software solutions that use AI and Machine Learning to enable next generation manufacturing processes, increase manufacturing yield, and decrease process downtime. Tignis products equip process and operations engineers with the tools necessary to design, test and implement AI projects, and ensure the successful implementation of AI process control and monitoring initiatives. Its technology is deployed in hundreds of facilities worldwide. 


 Products

  • PAICe Maker
    Physics-driven AI computational modeling platform that accelerates leading-edge semiconductor manufacturing, from equipment R&D to reliable high-yield chip fabrication capability. ...

  • With PAICe Maker, your semiconductor manufacturing equipment can have the power of AI and machine learning built-in, giving your fabrication customers the best control parameters to optimize each manufacturing run or batch.

     

    Using the latest AI and machine learning techniques, the PAICe Maker physics-driven computational modeling platform is:

     
    • Massively Multivariate: it can control systems in response to millions of complex measured properties while accounting for non-linear interactions.  
    • Adaptive: ML continuously improves as data is collected, helping the process controller self-tune to compensate for simulation model error, environmental changes, product changes, or equipment drift.
    • Immediate: physics-driven AI runs millions of times faster than legacy simulations, enabling real-time wafer-to-wafer recipe recommendations. 
    • Predictive: virtual metrology is built into the controller, enabling downstream process modification for better yield.
  • PAICe Monitor
    Process control platform with the power of AI and machine learning-enabled analytics for all stages of the semiconductor process lifecycle. ...

  • With the power of machine learning, PAICe Monitor enables your process engineers and equipment technicians to troubleshoot and resolve nonstandard events in the production line, improve processes, and review technological health and stability. 

     

    Tignis helps you improve fabrication productivity and achieve your goals, whether high yield in high volume production, faster cycle time, or cost savings.

     

    Leveraging Tignis’ Digital Twin Query Language, PAICe Monitor enables you to easily harness the power of AI and physics-driven computational modeling throughout your fabrication processes by:

     
    • Autonomously identifying root causes of critical yield issues using the latest in AI and machine learning techniques.
    • Identifying multivariate and non-linear relationships between process variables and critical wafer measurements.
    • Instantly deploying analysis to real-time monitoring to prevent future yield issues.

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