Yield Engineering Systems, Inc.

3178 Laurelview Ct
Fremont,  CA  94538

United States
http://www.yieldengineering.com
  • Booth: 841


Solutions for surface modification and material enhancement

For over 40 years, YES has been at the leading edge of material modification and surface enhancement solutions. Starting out as a small company making lab tools, YES has transformed itself into a trusted provider of extremely reliable, high-value high-volume manufacturing equipment. Energized by a new executive team, we are building on our long-standing reputation for reliability and technical expertise. Our systems and solutions are the preferred choice in multiple growing high-tech markets including semiconductors, display and life sciences.

Our Cure systems, including YES's flagship Verta- family, use vacuum technology to outgas solvents thoroughly and strengthen bonds for superior reliability and processing speed. Our Coat systems -- EcoCoat and UltraCoat -- transform a surface by applying a layer just one molecule thick. Our Clean systems use gentle or aggressive plasma to prepare substrates for processing. Our versatile VertaBond offers low-temp direct bonding and high-temp vacuum annealing in a single production-proven system. Our product portfolio also includes electrolytic and electroless plating, high-temperature processing and LPCVD.

 Products

  • Automated Linear Transfer (ALT) Wet Process System
    The versatile ALT surface prep system for wafers, polysilicon chunk & custom substrates is a proven and trusted choice for a wide range of in-line wet processes – from SC1, SC2, and pre-diffusion cleans to metal etch, acidic processes, and resist strip....

    • Engineered to address the customer’s specific requirements, the flexible ALT platform can be configured for manual load, semi-automatic load, or fully automatic operation. ALT’s proven immersion technology offers greater thermal uniformity, reduced chemical usage, and uniform chemical exposure, while its unique all-side overflow baths minimize surface contamination. ALT system modules incorporate the finest quality components, including FM-4910 cleanroom-certified plastics and ULPA (Ultra Low Particulate Air) filtration to remove 99.999% of particles greater than or equal to 0.1µm. Stainless steel modules are available for solvent-based processes.
  • VertaBond
    High-volume automated vacuum anneal system for WtW hybrid bonding, die-to-panel (DtP) and panel-to-panel (PtP) bonding...

    • The YES VertaBond is a production-proven automated vacuum anneal system equipped with uniform temperature control and laminar gas flow. This flexible system has an EFEM integrated with two process modules that can accommodate 200mm and 300mm wafers, or panel sizes ranging from 400mm to 550mm. The VertaBond wafer systems can process batch sizes of 50 wafers (one PM) or 100 wafers (two PMs). VertaBond panel systems can process batches of 12 panels (one PM) or 24 panels (two PMs). 

    VertaBond's vacuum technology delivers void-free bonding in less time and at lower temperatures, and Cu-Cu bonding without voids, delamination, or dishing. Laminar gas flow dramatically reduces particle contamination. 

    Common applications for the VertaBond system include 3D packaging, CMOS image sensors under panel, polyimide bake, copper anneal, wafer-to-wafer bonding anneal, DtP bonding, and PtP bonding.

  • UltraCoat
    Automated silane vapor deposition system for high-volume manufacturing...

    • Get controllable, consistent coating results for automated high-volume manufacturing, while minimizing chemical usage and cost of ownership. UltraCoat is well-suited for a wide variety of applications requiring precise surface modification with high throughput and reliability. 

Categories

200 Packaging and Assembly Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Solder Reflow; Soldering & Brazing Equipment
  • Wire Bonding Equipment
    • 202 Other Equipment
  • Molding; Encapsulation; Decapsulation Equipment
  • Vacuum drying & out gassing Systems
    • 204 MEMS Equipment
  • Deep RIE etching; Dry Etching
    • 205 Nanotechnology Equipment and Tools
  • Equipment, Nanotechnology Tools
    • 206 PV Equipment
  • Other
  • Thin Film
  • Wafers
    • 207 Process Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Coat; Develop; Resist Processing; Track Equipment
  • Deposition; (CVD, PVD, ALD, Plating)
  • Deposition; PVD; Sputtering; Evaporation Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Lithography/Exposure
  • Plating; Electro Chemical Plating; Deposition Systems
  • Thermal Processing
    • 700 Manufacturing Services
  • Deposition Service
    • 701 Manufacturing Services or Consulting
  • Manufacturing Process Support and Development
    • 900 Support Products
  • Device; Wafer; Display Panel Handling Products

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