Besi (BE Semiconductor Industries N.V.)

33 East Comstock Drive
Suite 4
Chandler,  AZ  85225

United States
http://www.besi.com
  • Booth: 1632

Besi invites you to our booth #1632 - Semicon West 2022.

Continuing our tradition as a leading advanced packaging semiconductor manufacturing solutions provider, we take great pride in sharing our latest technology for

  • Hybrid Bonding
  • Thermal Compression Bonding (TCB)
  • Die Attach
  • Multi Chip and Component Die Attach
  • Flip Chip
  • Molding
  • Saw Singulation
  • Trim & Form
  • Plating Equipment. 

We look forward to seeing you and allowing us to show you how BESI’s solutions in advanced packaging can meet your manufacturing needs.  

Categories

200 Packaging and Assembly Equipment
  • Cut & Down Set; Trim; Form Equipment
  • Deflashing; Degating Tools
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Lead Finishing; Straightening Equipment
  • Molding; Encapsulation; Decapsulation Equipment
  • Plating; Electro Chemical Plating for device assembly
  • Wafer Level Bonders
  • Wire Bonding Equipment
    • 202 Other Equipment
  • Molding; Encapsulation; Decapsulation Equipment
    • 204 MEMS Equipment
  • Wafer Level Bonders
    • 206 PV Equipment
  • Modules
  • Other
    • 700 Manufacturing Services
  • Repair; Rebuild; Install Equipment; Maintenance Svcs; Spares

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