EO Technics Co. Ltd.

Suite 121 219 S. William Dillard Drive
Gilbert,  AZ  85233

United States
http://www.eotechnics.com
  • Booth: 635


Welcome and thank you for visiting EO Technics!

EO Technics is a total laser company in the field of semiconductor, display, PCB and macro. We're manufacturing the laser processing equipment. EO Technics is a leader of laser marking industry. We also supply top-quality laser solutions for cutting, drilling, patterning, grooving, and welding.

We will make forays into all areas of the laser industry and become a global total laser solution provider.

 Products

  • SI Internal Dicing System
    SI Internal Dicing System...

    • Inner focus : Nanosecond pulse laser which is condensed into the inside of a silicon wafer is scanned in the horizontal direction.
    • In this case, it has No chipping / no side wall damage and will lead to higher die strength and Higher package yield compared conventional process.
    • Zero dicing kerf width that can enable narrower street design
  • Grooving
    • LMC3200G removes the low-k material and metal pattern layers on the wafer saw lane. • It not only improves the yield rate but also reduces wafer chipping during the blade dicing processing. ...

    • LMC3200G removes the low-k material and metal pattern layers on the wafer saw lane.
    • It not only improves the yield rate but also reduces wafer chipping during the blade dicing processing.
  • Wafer Marking System
    Wafer Backside marking system (CSM series) / Topside marking system (WM series)...

    • CSM series
      • wafer level chip scale marker for semiconductor and can mark on wafer backside without any chip damages.
      • The equipment has an automated calibration system to compensate scanner accuracy and an automated marking inspection system to check the marking results.
    • WM series
      • Wafer ID marking system used in cleanroom.
      • It has high-degree stability and high-speed processing. It also has OCR edit function which the user can edit by themselves.

Categories

200 Packaging and Assembly Equipment
  • Cut & Down Set; Trim; Form Equipment
  • Deflashing; Degating Tools
  • Dicing; Sawing; Scribing; Separation Equipment
  • Marking; Imprinting; Labeling Equipment
    • 201 Flat Panel Display Equipment
  • Laser Treatment; Cutting Systems for Panels & Photocells
    • 202 Other Equipment
  • Cutting; Drilling; Laser ablation; Beveling Equipment
    • 206 PV Equipment
  • Modules
  • Thin Film
  • Wafers
    • 207 Process Equipment
  • Bumping Systems
    • 701 Manufacturing Services or Consulting
  • Wafer Handling

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