【Diamond Beveling Wheel】
This wheel is used for beveling grinding semiconductor wafers.
We offer "ME" bond for wheels for beveling silicon wafers with excellent sharpness and high maintenance of groove shape. The finished surface roughness is excellent, and the amount of polishing after beveling process is reduced, leading to lower total processing costs by reducing the post-process time and consumables.
For wheels for beveling Sic and Sapphire wafers, we offer optimal bond wheels with excellent sharpness and grinding durability. Electroplating beveling wheels are also available for small and medium volume production.
For wheels for beveling LT and LN wafers, we offer optimal bond specifications that suppress the occurrence of chipping on brittle wafers.。
In addition to general R-shaped (round/full round) and T-shaped grooves, special shapes such as asymmetrical shapes are also covered, so please consult with us.
Applicable materials:
Silicon, SiC (silicon carbide), Sapphire, LT (lithium tantalate), LN (lithium niobate), GaN (gallium nitride), GaAs (gallium arsenide), and Quartz
【Dimaond Notch Wheel】
The demand for quality in the notch area of silicon wafers has been increasing year by year, and the notch wheel abrasive grains with a higher grain size number are increasingly being used. The challenge is to increase the service life of notch wheels that use abrasive grains with high grain size such as #3000.
Although the life of the notch wheel tends to become shorter due to the higher grain size number, the life can be enhanced by improving the hardness and strength of the notch wheel bond. In addition, the use of our original dressing technology AD-C allows for further improvement in service life.
We can provide notch wheels that are compatible with various types of wafers, including compound semiconductors.