Besi invites you to our booth #1632 - Semicon West 2022.
Overview
Continuing our tradition as a leading advanced packaging semiconductor manufacturing solutions provider, we take great pride in sharing our latest technology for
- Hybrid Bonding
- Thermal Compression Bonding (TCB)
- Die Attach
- Multi Chip and Component Die Attach
- Flip Chip
- Molding
- Saw Singulation
- Trim & Form
- Plating Equipment.
We look forward to seeing you and allowing us to show you how BESI’s solutions in advanced packaging can meet your manufacturing needs.