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Besi (BE Semiconductor Industries N.V.)

Chandler,  AZ 
United States
http://www.besi.com
  • Booth: 5657

Besi invites you to our booth #1632 - Semicon West 2022.

Overview

Continuing our tradition as a leading advanced packaging semiconductor manufacturing solutions provider, we take great pride in sharing our latest technology for

  • Hybrid Bonding
  • Thermal Compression Bonding (TCB)
  • Die Attach
  • Multi Chip and Component Die Attach
  • Flip Chip
  • Molding
  • Saw Singulation
  • Trim & Form
  • Plating Equipment. 

We look forward to seeing you and allowing us to show you how BESI’s solutions in advanced packaging can meet your manufacturing needs.  


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