Loading...

3D-Micromac AG

Chemnitz,  Saxony 
Germany
https://www.3d-micromac.com
  • Booth: 1064

Overview

3D-Micromac AG - Micromachining Excellence

3D-Micromac is the leading specialist in laser micromachining. Our team of experts develop processes, machinery and complete systems at the highest technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. Our target is to completely satisfy customer demands even on the most complex projects.

In the field of laser contract manufacturing, we offer the customer-specific development of laser processes as well as the contract manufacturing of components and workpieces for small and large series.

3D-Micromac adheres to high-performance and future-oriented processes at high production efficiency. Our technologies have set international standards for true innovation.


Our subsidiaries:

3D-Micromac America, LLC

Joshua Stearns

Phone: +1 603-305-4263

Email: [email protected]

780 Montague Expy #306
San Jose, CA 95131
USA


  Press Releases

  • The microPREP™ PRO FEMTO system enables micrometer-precision material removal at considerably higher speeds versus FIB milling while avoiding thermal damage to the sample

    Chemnitz, Germany, April 12, 2023 - 3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, glass and display markets, today introduced the microPREP™ PRO FEMTO laser micromachining system for high-speed Atom Probe Tomography (APT) and cross-section sample preparation.

    Fulfilling a critical need for atomic-scale materials analysis, the microPREP PRO FEMTO system features a femtosecond laser and optimized optical setup, which enables micrometer-precision removal of material in minutes versus many hours with focused ion beam (FIB) milling while avoiding mechanical and thermal damage to the sample. The microPREP PRO FEMTO enables APT microtip coupons to be prepared directly from the sample material with automated workflows. This frees up valuable FIB resources to be utilized more cost effectively for final preparation steps only, such as final annular focused milling and polishing of the microtips.

    The Department of Materials Science at Montanuniversität Leoben (the University of Leoben), a leading research university in the fields of mining, metallurgy and materials science, has purchased the first microPREP PRO FEMTO system and is now using it for the preparation of APT specimens, focusing on a variety of different materials. According to Dr. Michael Tkadletz, Chair of Functional Materials and Material Systems at Montanuniversität Leoben, “APT is a crucial technique for the knowledge-based development of modern high-performance materials. For example, it can help to illuminate the segregation of impurities and tramp elements at grain boundaries of green steels, to reveal the complex elemental distribution within multifunctional coatings and nanostructures, or to investigate the effects of local chemistry on the performance of energy storage and conversion materials. Yet, the major bottleneck for APT experiments is the elaborate and time-consuming specimen preparation. Femtosecond laser preparation using the microPREP PRO FEMTO helps to overcome this bottleneck by reducing the complexity of the process, significantly reducing the time-to-sample and FIB utilization, while at the same time, the number of prepared specimens can be substantially increased compared to a standard lift-out-procedure.”

    New Approaches Needed for APT Sample Prep

    Traditionally, APT sample preparation processes have been based on electrolytic or ion-based thinning workflows. Both workflows require mechanical preparation steps that introduce mechanical stress to the specimen, which can affect the overall quality and yield. Using FIB milling for the preparation process to avoid mechanical stress can take many hours to complete and requires specialized lift-out of the specimen, which introduces risk of damaging the specimen. Since FIB systems are costly, this approach also ties up FIB resources and results in very high operational costs for the user.

    Some systems combine a laser for high-speed ablation and an FIB for final polishing in a single platform. However, this approach creates capacity bottlenecks since only one process can be used at a time. In addition, since laser preparation ablates high volumes of material, particle contamination inside the analytic area of combination laser/FIB tools becomes a much bigger issue and its removal is difficult due to the vacuum conditions inside the isolated laser or process chamber. Short pulse lasers can also cause large heat-affected zones (HAZs), which can not only damage the sample but also can modify the structure of the probe tips, leading to inaccurate measurement results.

    Unlike these other approaches, the microPREP PRO FEMTO is a dedicated laser micromachining solution that utilizes a femtosecond laser to provide the high speed, accuracy, cost-effectiveness, and versatility that research labs and universities require for APT sample preparation and cross-section analysis.

    Dedicated Femtosecond Laser Micromachining

    The microPREP PRO FEMTO can mill samples down to two microns from the final pillar – reducing APT sample preparation time from many hours to just minutes compared to FIB milling. Its femtosecond laser source limits the HAZ of the working sample to a few nanometers, compared to sub-micrometer-range HAZ with picosecond lasers. The system also features an optimized optical setup that includes a telecentric objective, which enables higher precision when preparing APT microtip coupons. This is especially important for coupons containing many APT pillars. The optical setup also features a shorter focal length and smaller laser spot size, adding to its high precision.

    In addition, the microPREP PRO FEMTO features 3D-Micromac’s integrated proprietary CO2 Snow Jet contactless, non-abrasive cleaning system, which uses compressed air and dry ice in a normal atmosphere to safely remove particles from the surface of the sample following the laser preparation process. The microPREP PRO FEMTO also includes multiple pre-defined workflows, which facilitate setup and operation, and enable its use for a variety of use cases and applications.

    “As materials science progresses deeper into the sub-nanometer and atomic scale, the demand for atom probe tomography for high-resolution and 3D-imaging-based materials analysis continues to grow. Prefabrication of microtip arrays for APT specimen preparation using a dedicated femtosecond laser ablation system can provide tremendous savings in time, effort and expense compared to mechanical sawing, FIB milling and short-pulse lasers,” stated Dr. Boris Arnold Rottwinkel, product manager microdiagnostics at 3D-Micromac. “By leveraging our expertise and technology leadership in laser micromachining solutions as well as in laser-based sample preparation through our microPREP PRO family, 3D-Micromac can

    offer research labs and universities a highly cost-effective, scalable and versatile approach to APT specific preparation to meet their growing and more demanding materials analysis needs.”

    3D-Micromac is exhibiting at several leading international conferences on microscopy where attendees can learn more about the microPREP PRO FEMTO. Among these are: Microscopy and Microanalysis (M&M) in Minneapolis, Minn., July 23-27; the 20th International Microscopy Conference (IMC20) in Busan, Korea, September 10-15; and ISTFA in Phoenix, Ariz., November 12-16.

    In addition, Dr. Tkadletz of the University of Leoben will be presenting on the benefits of using the microPREP PRO FEMTO in his research at the 57th Metallography Conference (ASMET) in Leoben, Austria, September 13, and at the 93th IUVSTA Workshop in Seggau, Austria, October 15-19.

    For more information on the microPREP PRO FEMTO, visit: www.microPREP.pro.

    About 3D-Micromac

    Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading-edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. For more information, visit the company’s website at www.3d-micromac.com.

    Company Contact:

    Mandy Gebhardt

    Team Leader Marketing and Public Relations

    3D-Micromac AG

    Tel: +49 371 40043-26

    E-Mail: [email protected]

    Agency Contact:

    David Moreno

    Principal

    Open Sky Communications

    Tel: +1.415.519.3915

    E-Mail: [email protected]


  Products

  • microPRO™ XS OCF
    3D-Micromac's microPRO™ XS OCF provides highly-selective laser annealing for ohmic contact formation (OCF) in silicon carbide (SiC) power devices with high repeatability and throughput....

  • The formation of ohmic contacts on the backside of SiC power devices plays a key role in defining the electrical characteristics and mechanical strength of the device.

    Traditionally, thermal annealing processes using flash lamps with millisecond pulses have been used for OCF on the backside of SiC wafers. Because this process requires temperatures of upwards of 1000° C, which can be detrimental to structures on the front side of the wafers, flash lamps are limited to wafer thicknesses of 350 microns and above.

    As the industry now migrates to thinner SiC power devices for improved electrical performance and thermal management, new annealing solutions are needed that minimize these thermal effects. The microPRO XS for OCF features a UV-wavelength diode-pumped solid-state (DPSS) laser source with nano-second pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat-related damage to the front-side of the wafer.

    The microPRO™ XS OCF system provides selective laser annealing with high repeatability and throughput in a versatile system. Combining a state-of-the-art laser optic module with 3D-Micromac’s modular processing platform, the microPRO™ XS is ideally suited for ohmic contact formation (OCF) in silicon carbide (SiC) power devices. It forms ohmic interfaces a while preventing the generation of large carbon clusters and heat-related damage to the front-side of the wafer.

  • microPREP™ PRO
    microPREP™ PRO is 3D-Micromac‘s laser-based sample preparation system, that provides smart sample preparation processes for a variety of specimen preparation applications....

  • With its integrated ultrashort pulsed laser source, it complements existing approaches to sample preparation such as ion beam processing, x-CT, and microscopic analysis of any kind.

    microPREP™ PRO is suited to ablate metals, semiconductors, ceramics, polymers, and compound materials. It creates new vistas for material and process development as well as failure analysis.

    At sufficient power, laser radiation is able to ablate all kinds of materials. Furthermore, lasers can be positioned very precisely on a given workpiece and straightforwardly focused using standard optical elements. By using ultra-short pulse lengths in the picosecond range, superficial surface heat influence from ablation is narrowed to depths of a few microns or less.

    With sophisticated workflows microPREP™ PRO meets the specific requirements of several analytical techniques. Therefore, microPREP™ is perfectly suited to complement TEM, SEM/FIB cross sectional analysis, atom probe, X-ray tomography and micromechanical testing processes. In addition, numerous patents ensure competitive advantages for users compared to existing approaches in the field of sample preparation.

    microPREP™ PRO reduces time-to-sample significantly. Moreover, microPREP™ PRO gurantees a higher utilization of other tools within the analysis chain while keeping the costs of ownership low.

    NEW! Our microPRO system is now available as FEMTO tool. Its femtosecond laser source and optimized optical setup enable fast material removal with nanometer precision. microPREP™ PRO FEMTO can prepare APT microtip coupons directly from the sample material with automated workflows.

  • microVEGA™ xMR
    3D-Micromac's microVEGA™ xMR system provides high-throughput laser annealing for monolithic magnetic sensor formation. The system can accommodate GMR and TMR sensors, as well as easily adjust magnetic orientation, sensor position and sensor dimension....

  • microVEGA™ xMR for selective laser programming of magnetic sensors is an industrial production-approved technology with many advantages. By enabling a one-step process, this solution significantly reduces the costs for sensor chip manufacturing. Selective laser pinning on microVEGA™ xMR is by far the most efficient technology in terms of cost, throughput, yield and quality (sensitivity) to accurately program magnet sensor devices. The microVEGA™ xMR is fully automated and can be programmed for different sensor and wafer designs by recipe. The conversion from GMR to TMR is done only by selecting the correct recipe. All important tool data during programming can be organized by product type, saved in log files and ― if required ― transmitted via standard data interfaces.


Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".