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UniTemp GmbH

Pfaffenhofen,  Germany
http://www.unitemp.de
  • Booth: 5941

UniTemp Germany - supplier for thermal equipment

Overview

UniTemp GmbH was founded in August 2000.
We are specialized in all kinds of thermal process equipment. Our success is based on more than 23 years experience in developing and producing R&D equipment for labs and small series production. Our key features are rapid thermal annealing systems, reflow solder ovens (fluxless and void free soldering) and high precision hot plates. We also offer a VSS Vacuum Solder System where flux can be used and a semicautomatic wire bonder which is perfect for R&D use .

We combine high tech equipment with best quality, perfect ergonomic handling and best design.Our focus is the special demand and customers application. We are very flexible in adapting our standard equipment according to special requirements. Our object in view is best support before and after sales.


  Products

  • RTP-200
    Rapid Thermal Annealing system ● For wafer size up to 200 mm dia. (8“) wafer size ● Ramp up rate up to 75 K/sec ● SIMATIC® controller with 7“ touch panel ● Vacuum up to 10-3 hPa (RTP-200-HV up to 10-6 hPa) ● Process gas line for Nitrogen ...

  • Application

    ● Implantation/Contact Annealing
    ● RTP, RTA, RTO, RTN
    ● Operation with inert gases, Oxygen, Hydrogen, Forming gas
    ● SiAu, SiAl, SiMo Alloying
    ● Low-k dielectrica
    ● Crystallization & densification
    ● Si-Solar Wafer Cells on glass by Features
    ● Precise fast ramp up and fast ramp down rates
    ● Excellent temperature uniformity
    ● Up to 4 gas lines (Mass Flow Controller)
    ● Integrated data logging
    ● Heated by Infrared Lamps
    ● SIMATIC® controller
    ● 50 programs with 50 steps

  • VPO-300
    VPO-300 Vacuum process oven ● For substrate size up to 300 mm x 300 mm ● Ramp up rate up to 40 K/sec. ● Ramp down rate up to 200 K/min. ...

  • ● SIMATIC® controller with 7“ touch panel
    ● Vacuum up to 10-3 hPa (VPO-300-HV up to 10-6 hPa)
    ● Process gas line with Mass Flow Controller for Nitrogen
    ● overpressure up to 0,2 MPa
    ● Temperature up to 1000 °C (optional up to 1200 °C)

    Application
    ● Implantation/Contact Annealing Annealing processes with or without vacuum up to 10-3 hPa/ 10-6 hPa. Easy profiling by using a SPS SIMATIC® controller with WIN based software.
    Perfect lab tool and also for production on a low cost base. High production output. A remote control can be adjusted and the system can easily integrated into a production line.
    ● RTP, RTA, RTO, RTN
    ● Operation with inert gases, Oxygen, Hydrogen, Forming gas
    ● SiAu, SiAl, SiMo Alloying
    ● Low k dielectrica
    ● Crystallization & densification
    ● Si-Solar Wafer Cells on glass by Si-Wafer bonding Features
    ● Precise ramp up and fast ramp down rates
    ● Up to 4 gas lines (Mass Flow Controller)
    ● 3 heating zones programmable, heated by Infrared lamps
    ● 50 programs with 50 steps each
    ● Top and bottom heating (selection by Software) ● Small foot prin


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