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SET CORPORATION SA

Saint-Jeoire,  France
https://www.set-sas.fr
  • Booth: 461

Develop the chips of the future with SET Flip-Chip Bonders.

Overview

Founded in 1975, SET - Smart Equipment Technology - based in France, is a world leading supplier of high accuracy Flip-Chip Bonders -Die-to-Die and Die-to-Wafer.

With equipment installed worldwide, SET is globally renowned for the unsurpassed submicronic accuracy and the flexibility of its Flip-Chip Bonders.

They adapt to all main bonding techniques: hybrid bonding, fluxless reflow, adhesive joining compression, thermosonic.

SET has representatives in North America and offers a comprehensive product portfolio of Flip-Chip Bonders for fast growing markets and serving clients through a global network of representatives and in-depth customer trainings.


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